TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized
Brand Name:ZMSH
Certification:rohs
Model Number:Through Glass Via (TGV)
Payment Terms:T/T
Place of Origin:CHINA
Price:by case
Contact Now
Add to Cart
Verified Supplier
Location:
Shanghai Shanghai China
Address:
Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
Supplier`s last login times:
within 13 hours
Product Details
Company Profile
Product Details
Abstract
TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via (TGV) Customized
The TGV sapphire wafer with laser-drilled apertures is an advanced substrate material fabricated by forming high-precision through-glass vias (TGV) on single-crystal sapphire (Al₂O₃) substrates via laser or etching processes. It combines sapphire’s exceptional hardness, high-temperature resistance, and optical transparency with TGV’s micro/nano-structuring capabilities.
Technical parameters
| Specification | Value |
| Glass Thickness | <1.1 mm |
| Wafer Sizes | All standard up to 200 mm |
| Minimum Microhole Diameter | 10 µm |
| Identical Hole Diameter | 99% |
| Positional Accuracy | ±3 µm |
| Chipping | None |
| Super Smooth Sidewalls | RA < 0.08 µm |
| Hole Types | Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse) |
| Hole Shape | Hourglass |
| Option | Singulation from hole-processed large-sized glass |
Key Features
- High Mechanical Strength: Mohs hardness of 9, scratch-resistant, and corrosion-resistant.
- Superior Thermal Stability: Withstands extreme temperatures (>2000°C) and exhibits low thermal expansion.
- Precision Through-Holes: Laser/photolithography enables micron-scale apertures with high aspect ratios.
- Optical Performance: Broadband transparency (80%+ @400-5000nm) from UV to IR wavelengths.
- Dielectric Properties: Excellent insulation (resistivity >10¹⁴ Ω·cm).
Applications
- Semiconductor Packaging: Heterogeneous integration substrate for 3D ICs and MEMS sensors (e.g., pressure/inertial sensors).
- Optoelectronic Devices: Transparent interposer for Micro-LEDs and vertical-cavity surface-emitting lasers (VCSELs).
- RF Components: 5G/mmWave antenna packaging (low dielectric loss).
- Biochips: Chemically inert transparent layer for microfluidic chips.
- Extreme-Environment Sensors: Aerospace and deep-well sensor windows.
Machining effect
Our advanced TGV wafers are engineered to enable high-performance metallization of microvias, ensuring optimal conductivity and structural integrity for cutting-edge applications.
We specialize in manufacturing TGV wafers with bespoke dimensions and microvia designs, tailored to seamlessly integrate with your preferred metallization processes—whether electroless plating, sputtering, or electroplating.
Product display
Our TGV glass wafers are precision-fabricated to deliver exceptional surface quality, enabling direct integration into your production workflow with minimal post-processing. High-density microvia arrays are uniformly distributed to meet stringent industry standards.
From concept to commercialization, we provide agile prototyping and high-volume production services to support your unique design requirements. Our flexible manufacturing capabilities ensure fast turnaround without compromising precision or reliability.
Q&A
1. Q: What are the advantages of sapphire TGV wafers over
traditional glass substrates?
A: Sapphire TGV wafers offer superior mechanical strength, higher
temperature resistance (>2000°C), and better chemical stability
compared to standard glass substrates.
2. Q: What applications are sapphire TGV wafers best suited for?
A: They are ideal for advanced semiconductor packaging, high-power
LED devices, and RF components requiring extreme durability and
precision microstructures.
Tag: #TGV, #TGV Sapphire Wafer Perforated Glass Substrate,
#Customized, #Through Glass Via (TGV), #BF33, #JGS1, #JGS2, #Sapphire
TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized
Inquiry Cart
0