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+ allow to be customized by design artwork
+ made by pure sapphire (99.999%Al2O3)
+ high-hardness 9 Mohs, outstanding scratch resistance
+ great transmittance, about 80%-90% in the visible light spectrum
(approximately 400-700 nm).
+ widely used for high-end watch faces, camera lenses, optical
instruments, medical devices, laser systems, high-precision sensors
Sapphire wafer is an important material widely used in
semiconductor, optoelectronic and LED manufacturing.
Sapphire wafer has excellent physical and chemical properties, such
as high hardness, excellent thermal conductivity and good optical
transmittance, especially in the ultraviolet to near-infrared band.
In the manufacturing process, sapphire wafers are usually prepared
by melt growth method (such as Czochralski method). This method can
produce high-purity, low-defect sapphire crystals to ensure the
quality and performance of wafers. In electronic devices, sapphire
as a substrate can effectively improve the stability and life of
the device.
The 4-inch sapphire wafer is one of the common specifications in
the current market. It is usually used to grow semiconductor
materials such as gallium nitride (GaN) to manufacture
high-performance light-emitting diodes (LEDs) and high-frequency
electronic devices.
In addition, sapphire wafers are also widely used in high-precision
optical components and integrated circuit substrates due to their
stable crystal structure and high temperature and corrosion
resistance.
With the advancement of technology, the application of 4-inch
sapphire wafers continues to expand, especially in the fields of
high-power electronics and photoelectric conversion. In the future,
the development and application of sapphire materials will continue
to promote the development of related industries and meet the needs
of higher performance.
Details of Sapphire Wafers
Item | 4-inch C-plane 430um Sapphire Wafers | |
Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 | |
Grade | Prime, Epi-Ready | |
Surface Orientation | A-plane(11-20) | |
Diameter | 50.8 mm ± 0.1 mm | |
Thickness | 430 um ± 25 um | |
Primary Flat Length | 16.0 mm ± 1.0 mm | |
Double Side Polished | Front Surface | Epi-polished, Ra < 0.5 nm (by AFM) |
(DSP) | Back Surface | Epi-polished, Ra < 0.5 nm (by AFM) |
TTV | ≤ 10 um | |
BOW | ≤ 10 um | |
WARP | ≤ 10 um | |
Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, | |
25 pieces in one cassette packaging or single-piece packaging. |
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FAQ
1. Q: How are sapphire wafers manufactured?
A: Sapphire wafers are produced using the Ky method. The KY method
is a technology used to grow high-quality sapphire crystals. It
uses a melt growth method and can effectively control the quality
and size of the crystals.
2. Q: Is the production process of sapphire wafer environmentally
friendly?
A: The production process of sapphire wafer needs to be strictly controlled in terms of environmental protection. The extraction, processing and disposal of raw materials may have an impact on the environment. Therefore, manufacturers need to take effective environmental protection measures.