12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use

Brand Name:zmkj
Certification:Cz/ Rohs/ GSG
Model Number:4.125/6.125/6inch/8inch
Minimum Order Quantity:1pcs
Delivery Time:3-4weeks
Payment Terms:Western Union, T/T, L/C
Contact Now

Add to Cart

Verified Supplier
Location: Shanghai Shanghai China
Address: Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
Supplier`s last login times: within 13 hours
Product Details Company Profile
Product Details

12inch dia300mm Borosilicate33 bf33 Glass Wafers Glass Substrate with high refractive index

8inch 1.0thickness dia100mm 0001 sapphire wafer 1sp or 2s


Product description

BF33 (Borofloat 33) by ZMSH is a type of heavy flint glass that is commonly used as a substrate material in various optical applications. It is known for its high refractive index and low dispersion, which makes it useful for applications that require high light focusing and power density. BF33 is made from a borosilicate glass, which has a low coefficient of thermal expansion and high resistance to thermal shock. This makes it an ideal substrate for high-temperature processing and for use in harsh environments. BF33 is commonly used in applications such as laser mirrors, beam splitters, and optical lenses, among others. The exact properties and characteristics of BF33 will depend on the manufacturer and the specific production process used to make it. Alternatives to BF33 (Borofloat 33) glass substrate include: BK7 glass substrate Fused Silica Sapphire Zerodur Corning Willow Glass Alumina


Specification

Spec4"6"8"12”
Diameter100mm150mm200mm300mm
Thickness

0.10mm

up

0.30mm

up

0.40mm

up

0.50mm up
Primary Flat32.5mm

47.5mm

/ 57.5mm

/ Notch

NotchNotch
LTV (5mmx5mm)< 0.5um< 0.5um< 0.5um< 0.5um
TTV< 2um< 3um<3um<10um
Bow±20um±30um±40um±40um
Warp≤ 30um≤ 40um≤ 70um≤ 80um
Edge RoundingCompliant with SEMI M1.2 Standard/refer to IEC62276
Surface TypeSingle Side Polished / Double Sides Polished
Polished side RaRa≤1nm
Back Side CriteriaRa 0.2-0.7um or Customized

WAFER FABRICATION PROCESS
Shape Cut
Thin sheets are scribed, thick sheets are water jetted and blocks are wire sawn to begin the process with a wafer "blank".


CNC Edge
Each wafer is individually edged on a Precision CNC Edge Grinding Station.


Lapping
As required, wafers are lapped to precise thickness or flatness.


Polishing
Double-side Commercial Polish removes subsurface damage and Super Polish creates a pristine finish.


Cleaning
We combine ultrasonics and megasonics on multiple cleaning lines which feed directly into a Class 100 Clean Room.


Inspection
In our Class 100 Optical Clean Room, we inspect to various quality levels under the appropriate lighting conditions.


Packaging
All wafers are packed in pre-cleaned containers, double bagged and vacuum sealed within the Class 100 Clean Room.


Product display


Related products:



FAQ:


Q: What's your MOQ?

A: (1) For inventory, the MOQ is 10pcs.

(2) For customized products, the MOQ is 25pcs up.


Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, EMS etc.

(2) If you have your own express account, it's great.If not,we could help you ship them.

Freight is in accordance with the actual settlement.


Q: What's the delivery time?

For inventory: the delivery is 5 workdays after you place the order.

For customized products: the delivery is 2 or 3 weeks after you place the order.


Q: Do you have standard products?

A: Our standard products in stock.as like 4inch 0.65mm,0.5mm polished wafer.

Q: How to pay?

A:50%deposit, left before delivery T/T,

Q: Can I customize the products based on my need?

A: Yes, we can customize the material, specifications and optical coating for your optical

components based on your needs.


China 12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use supplier

12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use

Inquiry Cart 0