High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

Brand Name:METS
Minimum Order Quantity:1 piece
Delivery Time:5-20days
Payment Terms:TT,LC
Place of Origin:XIAMEN.CHINA
Price:Negotiable
Contact Now

Add to Cart

Verified Supplier
Location: Xiamen Fujian China
Address: 102,No.42, Xibin Road,Xinglin,Jimei district,Xiamen,China,361022
Supplier`s last login times: within 23 hours
Product Details Company Profile
Product Details

Progressive stamping die for high speed press semiconductor lead frame


TO,DIP,ZIP,SIP,SOP,SSOP,TSSOP


Lead frames are the metal structures inside a chip package that carry signals from the die to the outside.

Leadframe for a QFP package
The die inside the package is typically glued to the lead frame, and then bond wires attach the die pads to the leads. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and outside of the lead frame is cut-off, separating all leads.


Progressive die for lead frame:
-- Discrete device lead frame dies: TO-92,TO-196,ITO-220,TO-252,TO-247,TO-3P etc.
-- IC lead frame dies:DIP-8L,DIP-16L,DIP-18L,DIP-28L,SOP-8L,SOP-16L,SOP-28L,SSOP-8L,SSOP-18L etc.
-- SMT lead frame dies: SOT-23,SOT-143 etc.


A. Material:0.2mm, 0.25mm, 0.3 mm thick brass, copper or stainless steel
B. Finishing:silver,gold ,palladium,tin ,nickel plated
C. Size: customized
D. Packing method: Polybag, carton box


Stamping Capability

A: The min. pitch: 0.5mm

B: Highest stamping speed: 600SPM/min or more

C: Precision: ±0.003mm

D: Rate of hole diameter and thickness 0.85:1

E: Stamping material thickness:0.05-2.0mm

F: zero or less loss of material use.


METS Precision-Tool uses a variety of 2D and 3D cad/cam Software to develop, design, and plan the layout of our dies. (see below for the full software list & details). We have the resources to build a die for any application. When high volumes of production are expected, we can build a dependable tool with longevity in mind. We can also produce low-cost tools for prototyping and sampling applications. Die protection is always on our mind, and DACO Precision-Tool can build in sensors that will help prevent costly damage to the die.


Tool&Die​ Profile

General CapabilitiesDesign Modeling 2D, 3D,processing,assemblingDie Location Technical SupportInspection
Detail Tooling DocumentationDFMEA/PFMEAQuick Building Prototypes
Die TypesForming DiesPrecision Progressive Stamping DiesSecondary Dies
High Speed Steel Stamping DiesPrecision Blanking DiesForming Die
Tooling MaterialCarbide(CD650,V3,KD20)ASP-23ASP-60
S55C---45#55AL7075SKD11
Tooling Life50 Million to 1000 Million Times
Die Concept2-Plate Die3-Plate DieModule Die
Production EquipmentCNCSODICK Nice Surface EDMP/G
DrillSODICK Wire Cutting MachineJ/G
Milling MachineWAIDA Profile Grinder Machine 
Stamping EquipmentAIDAPURDERMICO
MICO  
Stamping ProductCustom StampingSIM shrapnelSpring clip
Battery shrapnelShield DrawingPress-Fit Terminal
Lead FramePower Contact TerminalPC Terminal parts
Additional Services ProvidedCustom PackingPackagingHeat Treat
Plating  
Delivery3-5 Week3-6 Week4-7 Week

We accept your any request on shipment.By air, by sea,and by Express are acceptable.

 By ExpressBy AirBy Sea
West Europe3-5 days4-6 days22-30days
USA &Canada3-4days5-6 days16-27days
South Asia3-5 days3-7 days12-20 days
Japan&South Korea2-3 days3-4 days10-13 days
Russia-----------------30-40 days

Packing:

First Step Wrapping by PE film to anti-rust.

Second wooden case without need of fumigation.Or as your required.


FAQ

Q: What’s your manufacture capability?
---- We use Sodick/Charmilles to frabricate die inserts,dimension we can do is +/-0.002mm.

Q: Can you make all the dimensions are according to our design/samples?
---- We can guarantee that all the dimensions are made according to your drawing/sample.Please notice that dimension tolerence we can do is +/-0.003mm.

Q: Did the stamping die suit for my press machine?
--- The stamping die is made according to your press machine’s specification.Before start making die parts,we will send the design for your approval.

Q: What’s your advantage compare with other supplier’s on the market?
---- We are stamping factory,have a team contains die design,making,maintance and stamping production.We know how important the good mold for stamping production.

---- All our engineers are with more than 10 years working experience.They are more professional on precision stamping field.

---- All the die parts we made are by Slow-speed wire EDM,can gurantee the dimension.Many of them make it by middle-speed wire EDM/fast-speed wire EDM


Stamping die Shows:


China High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP supplier

High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

Inquiry Cart 0