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PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting
Machine
1. Description
Neat and smooth edge, no burr or overflow
Wide application range, including FPC exterior cutting, profile
cutting, drilling, opening window for covering, etc.
Laser wavelength: 355nm
Rated power: 10W/12W/15W/18W@30KHz
Galvanometer working field Per One Process: 40 × 40mm
Power consumption for the hole machine: 2KW
2. Features
More quick and easy, shorten the delivery time;
High quality ,no distortion,surface clean& uniformity;
Gathering the CNC tech,laser tech,software tech…High accuracy,High
speed;
3. Cutting Application
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws
Damages and fractures to substrates and circuits due to mechanical
stress
Damages to PCB due to accumulated debris
Constant need for new bits, custom dies, and blades
Lack of versatility – each new application requires ordering of
custom tools, blades, and dies
Not good for high precision, multi-dimensional or complicated cuts
Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB
depaneling/singulation market due to higher precision, lower stress
on the parts, and higher throughput. Laser depaneling can be
applied to a variety of applications with a simple change in
settings. There is no bit or blade sharpening, lead time reordering
dies and parts, or cracked/broken edges due to torque on the
substrate. Application of lasers in PCB depaneling is dynamic and a
non-contact process.
Advantages of Laser PCB depaneling/singulation
No mechanical stress on substrates or circuits;
No tooling cost or consumables;
Versatility – ability to change applications by simply changing
settings;
Fiducial Recognition – more precise and clean cut;
Optical Recognition before PCB depaneling/singulation process
begins;
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA,
Teflon, ceramics, aluminum, brass, copper, etc);
Extraordinary cut quality holding tolerances as small as < 50
microns;
No design limitation – ability to cut virtually and size PCB board
including complex contours and multidimensional boards.
PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting
Machine Parameters:
Laser | Q-Switched diode-pumped all solid-state UV laser |
Laser Wavelength | 355nm |
Laser Power | 10W/12W/15W/17W@30KHz |
Positioning Precision of Worktable of Linear Motor | ±2μm |
Repetition Precision of Worktable of Linear Motor | ±1μm |
Effective Working Field | 460mmX460mm(Customizable) |
Laser Scanning Speed | 2500mm/s (max) |
Galvanometer Working Field Per One Process | 40mmх40mm |
PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting
Machine Description:
PCB depaneling (singulation) laser machines and systems have been
gaining popularity over recent years. Mechanical
depanaling/singulation is done with routing, die cutting, and
dicing saw methods. However, as the boards get smaller, thinner,
flexible, and more sophisticated, those methods produce even more
exaggerated mechanical stress to the parts. Large boards with heavy
substrates absorb these stresses better, while these methods used
on ever-shrinking and complex boards can result in breakage. This
brings lower throughput, along with the added costs of tooling and
waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and
they also present challenges to the old methods. Delicate systems
reside on these boards and non-laser methods struggle to cut them
without damaging the sensitive circuitry. A non-contact depaneling
method is required and lasers provide a highly precise way of
singulation without any risk of harming them, regardless of
substrate.
More information welcome to contact us:
WhatsApp/Wechat(Bunny): +86 136 8490 4990
Email:s5@smtfly.com