Bipolar and Monopolar / Fractional RF Microneedle Technology / 220V
60HZ
Intracel RF Skin Resurfacing FRACTIONAL RF MICRONEEDLE
The traditional resurfacing lasers work by burning the surface of
the skin. Therefore, the treatment has to be repeated at lower
strengths over several sessions before you results become visible.
Intracel is a cutting edge skin resurfacing technology that
delivers heat the energy below the surface.
By bypassing the top most layer of skin Intracel is able to
practically negate the two most difficult hurdles of Fractional
anti-aging therapy: downtime and discomfort.
Intracel Fractional RF Microneedle directs RF energy just below the
skin therefore providing a comfortable, efficient treatment with
minimal downtime.
Treatment scope:
a.Continuous treatment from Epidermis to dermis –Tightening, Pore
size,
Superficial scar, Wrinkles
b.Stronger treatment power throughout dermis area-lifting
tightening, wrinkles,
flushing, Lightening and Acne.
c.Bio-modulation effect by combination treatment with fibroblast
media through
micro delivery hole, Micro electrodes make-scar, Acne,
Pigmentation, PIH,
Flushing, Whitening and moisturizing.
Post Treatment Care
Mild redness and swelling may occur a few hours and up to 24 hours
after treatment. Massage and excessive sun exposure should be
avoided at this time. More aggressive treatment may result in skin
flaking as the new skin layer regenerates. Moisturisers and broad
spectrum sunscreens are highly recommended during this recovery
phase.
Technical Parameters
Control System | Microcomputer |
Operation Interface
| 8.4" Colorized Touch Screen
|
Power Voltage
| 110/220V; 50/60Hz |
Needle Depth
| 0.5mm, 1mm, 1.5mm
|
Treatment Area
| 62mm² |
Electrode No.
| 36 Pins |
Work Program
| CW / Pulse |
RF | 2MHz & 50W |
Before-after-pictures:
Three Layer Therapy
Targeting three different target tissue with one single device is
attracting both user and patient
Our Factory
For more information, please visit our website www.nubway.com, or e-mail me at vivian@nubwaybeauty.com.