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Rogers 4003 4 Layer advanced fabrication pcb Used In Collision Avoidance Radar Systems
Quick detail:
Origin:China | Special: High frequency pcb |
Layer:4 | Thickness:0.79mm |
Surface: ENIG | Hole:0.2 |
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the
products quality ,with high techolonogy treatment improve the life
cycle of the products .Immersion gold surface finish make the pcb
's conductive performance enhancements. Multilayer pcb design ,the
precision of the pcb improves much more better . Low dielectric : 3
dielectric conductivity much more precision .
Typical Applications:
The basic characteristics of high-frequency substrate material
requirements are the following:
(1) the dielectric constant (Dk) must be small and very stable,
usually the smaller the better the signal transmission rate and the
dielectric constant
Of the square root is inversely proportional to the high dielectric
constant is likely to cause signal transmission delay.
(2) Dielectric loss (Df) must be small, which mainly affects the
quality of signal transmission, the smaller the dielectric loss so
that the signal loss is also smaller.
(3) and copper foil thermal expansion coefficient as far as
possible, because inconsistencies in the change in the cold and
heat caused by copper foil separation.
(4) low water absorption, high water absorption will be affected in
the damp when the dielectric constant and dielectric loss.
(5) Other heat resistance, chemical resistance, impact strength,
peel strength, etc. must also be good.
In general, the high frequency can be defined as the frequency of
1GHz or more.Now more high frequency circuit board substrate is
fluoride Shito media
Substrate, such as polytetrafluoroethylene (PTFE), usually called
Teflon, usually used in more than 5GHz. There are also used FR-4 or
PPO substrate, can be used between 1GHz ~ 10GHz products, the three
high-frequency substrate properties are as follows.
At this stage of the epoxy resin, PPO resin and fluoride resin
three types of high-frequency substrate materials, epoxy resin into
Of the fluorine-based resin is the most expensive, while the
dielectric constant, dielectric loss, water absorption and
frequency characteristics of the fluorine resin
Most preferably, the epoxy resin is poor. When the frequency of
application of the product is higher than 10GHz, only fluorine
resin printed board can be applied. Obviously
Easy to see, fluorine resin high-frequency substrate performance is
much higher than other substrates, but its shortcomings in addition
to high cost is poor rigidity, and thermal expansion
Expansion coefficient larger. For polytetrafluoroethylene (PTFE),
in order to improve performance with a large number of inorganic
materials (such as silica SiO2) or
Glass cloth as reinforcing fill material, to improve the rigidity
of the substrate and reduce its thermal expansion. Also because of
PTFE resin itself
Molecular inertia, resulting in not easy to combine with the copper
foil is poor, it is necessary with the copper foil surface of the
special surface treatment. Approach
On a PTFE surface for chemical etching or plasma etching to
increase the surface roughness or in the copper foil with PTFE
Alkene resin layer between the adhesive layer to increase the
bonding strength, but may have an impact on dielectric properties,
the entire fluorine-based high-frequency circuit-based
The development of boards requires suppliers of raw materials,
research units, equipment suppliers, PCB manufacturers and
communication products manufacturers, etc.
Multi-cooperation, to keep up with the rapid development of
high-frequency circuit board in this area needs
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
PrePreg Material
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Company Service:
24 hours quick sample is avaliable here.
reply Customer's any enquiry within 3 hours;
Blind buried hole ,crossed blind hole can be done
24 hours Engineering Gerber files treatment.
24 hours English Engineering Questions Confirmation by E-mail.
Supply the best project fit for production customized