High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb

Brand Name:XCE
Certification:CE,ROHS,FCC,ISO9008,SGS,UL
Model Number:XCE BT66
Minimum Order Quantity:MOQ 1 Piece
Delivery Time:5-10 working days
Payment Terms:T/T, Western Union
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Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
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Product Details

High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb


Quick Detail :


TypePcb
MaterialF4B
LayerMultilayer
Size12*5cm
Permittivity2.2
ColorGreen
Surface FinishENIG




Features:


RO3035™ high frequency circuit materials are ceramic- fi lled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3000® series laminates are ceramic-fi lled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.


Parameter:


ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2


Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger



Data :

Layer1 to 28 layers
Material typeFR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness0.21mm to 7.0mm
Copper thickness0.5 OZ to 7.0 OZ
Copper thickness in hole>25.0 um (>1mil)

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance


Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
CertificateUL, ISO 9001, ISO 14001
Special requirementsBuried and blind vias+controlled impedance +BGA
ProfilingPunching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.


Benefits:

  • Laminates can be used in applications up to 30-40GHz
  • Reliable stripline and mulilayer boards constructions
  • Ideal for multilayer board designs with a range of dielectric constants
  • Suitable for use with epoxy glass multilayer board hybrid designs
  • Ideal for applications sensitive to temperature change
  • Lower operating termperature and increase reliability in power amplifier applications

Typical Applications:

  • band pass filters
  • microstrip patch antennas
  • voltage controlled oscillators

Production Description :

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

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China High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb supplier

High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb

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