4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna
Brand Name:XCEPCB
Certification:SGS,ISO9001,UL
Model Number:XCEF-A
Minimum Order Quantity:1 pcs
Delivery Time:3-12 WDS
Payment Terms:Western Union,, T/T
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Location:
Shenzhen Guangdong China
Address:
Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times:
within 27 hours
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FR4 4 Layer Half Bluetooth Module With Exposure Gold Of Antenna
| Layer:4 | Material:FR4 |
| Copper THK:1OZ | Board THK:0.8mm |
| Finish: ENIG | Origin: China |
Bluetooth module, is an integrated Bluetooth PCB board for short-distance wireless communication, Bluetooth data modules are divided into functions and Bluetooth voice module.
| 1 | Description | PCB Specification |
| 2 | Material | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum |
| 3 | Layer | 1-20 |
| 4 | Board Thickness | 0.2mm- 4.0mm |
| 5 | Board Thickness Tolerance | +/-10% |
| 6 | Copper thickness | 17.5um-175um (0.5oz-5oz) |
| 7 | Min Trace Width | 0.15mm |
| 8 | Min Space Width | 0.15mm |
| 9 | Min Drilling Dia | 0.2mm |
| 10 | PTH copper thickness | 0.4-2mil(10-50um) |
| 11 | Tolerance of Etching | ±1mil(±25um) |
| 12 | V-cut angle | 25°,30°,45°,60° |
| 13 | Pearl Strength of line | ≥ 6lb/in(≥ 107g/mm) |
| 14 | Impedance control and tolerance | 50Ω±10% |
| 15 | Twist&Wrap | ≤ 0.5% |
| 16 | Soldermask | Green, Red, Blue, White, Black, Yellow |
| 17 | Surface Finish/Plating | HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG |
| 18 | Certificate | ROSH. ISO9001, UL Certificate |
| 19 | File | Protel 99se/P-CAD/Autocad/Cam350 |
| 20 | Inner packing | Vacuum packing,Plastic bag |
| 21 | Outer packing | Standard carton packing |
4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna
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