3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design

Brand Name:XCE
Certification:CE,FCC,Rohs,ISO9001,SGS,UL
Model Number:XCER
Minimum Order Quantity:1PCS
Payment Terms:Western Union, L/C, T/T
Place of Origin:China
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Site Member
Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
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Product Details

3D Printer Multi-Layer Rigid PCB Circuit Boards With Specialty Metal Core


Quick detail:


Place of Origin:Guangdong, China (Mainland)
Brand Name: XCE
Model Number: XCER
Number of Layers: 6-Layer
Base Material: FR-4
Copper Thickness: inner layers 1oz, outer layers 1.5oz
Board Thickness: 62mil
Surface Finishing: immersion gold

Parameter:


Layer No.1-26
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)

PCB Capabilities By Market:


1.

High Reliability PC Boards


-Up to 2000 Thermal cycles




2.

Burn-in Boards


-6 Layers - .042" thick


-.5 mm pitch


-Step-down connectors


-Special materials


-Large sizes up to 24" x 28"


-High Reliability


3.

High Technology Boards


-Microelectronics (Line and Space down to .00125"/.00125")


-Differential Impedance


-Up to 30 Layers


-Lead Free process


-Special materials


-Sequential lamination


-Blind and buried vias


-Laser Drill


-Filled vias


-Via in pads


-Milspec


China 3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design supplier

3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design

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