Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:XCEM
Minimum Order Quantity:1pcs
Delivery Time:5-10 days
Payment Terms:T/T,Western union
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Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
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Product Details

Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards


Specification:


  • Material: Rogers R4350
  • Layer counts: 6
  • Finish thickness: 2.72±10%mm
  • Min via diameter: 0.35mm
  • Surface finish: ENIG

Parameter:


Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating
China Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards supplier

Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

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