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3OZ Copper 10 Layer Multi-Purpose PCB with FR4 High Frequency PCB
Circuit Board
Specification:
Base Material: FR4
Copper Thickness: 1OZ
Min. Hole Size: 0.25MM
Min. Line Width: 0.75MM
Min. Line Spacing: 0.75MM
Surface Finishing: HASL,OSP
Slik screen color: white/black/blue/green/red/yellow
Type: factory
Shipping: DHL/FEDEX/UPS/EMS/TNT
Certification: UL/ROSH/SGS
Oem service: accept and welcome
Parameter:
Model | XCEF-5 |
IPC Class | Class II, Class III , Class 1 |
Annular Ring | 5 mil/side or Greater (Min. Design) |
Finish Plating | Immersion Gold |
Copper THK | 1zoz |
Trace/Space Width | 3 Mils or Greater |
Drill Clearance | 0.1mm(laser drilling) |
Plated Slots | 0.036 or Greater |
Smallest Hole | 0.1mm or Greater |
Board Size | 10*10cm |
Board THK | 1.8MM |
Soldermask Type | LPI Glossy, LPI-Matte, SR1000 |
Soldermask Color | Green, Red, Blue, Black, White, Yellow, |
Legend Color | White, Yellow, Black, Red, Blue |
CNC Route Point | Any |
Minimum Route Width | 0.031” |
Scoring | Straight Lines, Jump Scoring, Panel Edge to Edge, CNC* |
Body Gold | HARD*, IMMERSION* (up to 50 MICRON GOLD) |
Data File Format | Gerber 274x with embedder aperture |
Fab. Drawing Format | DXF, HPGL, DWG, PDF, Gerber |
E.T Testing | Flying Probe, Single Sided, 1up Plate, Clampshell, Net List |
Counter Sink / Counter Bore | Availiable up to 0.250 Diameter |
Control Impedence | Yes |
Blind Vias / Buried Vias | Yes |
Peelable Mask | Yes |
Carbon | Yes |
Description:
XCE was established in 2002, an over 13 year PCB manufacturer in Shenzhen
We have 6 Years high frequency pcb production experience
We are certified by ISO13485, TS16949, ULE332411, ISO14001, ISO9001
70% of our customers are from Europe and North America
We use very good material, such as KB, Shengyi, etc
100% of our prodcuts are tested and 100% pass before delivery
Fast samples for your test
Advantage:
sufficient stocks of hi-frequency pcb materials such as
Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16)
mainly used in the area of high technologies.
special and high precision printed circuit boards with the strong
production capability of 2 to 28 layers of highly precise
impedence,multi-layer blind buried,multi-layer
mix-compression,highTG, copper substrate,Ceramic substrate PCB.