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High Frequency FR4 Sensor PCB Boards 5.8GHZ For Induction Lamp
Quick Detail:
Model: XCEF
Brand: XCE
Name: Sensor PCB
Origin: China
Material: FR4
Number of layer: 2
Electric strength | >1.3kv/mm | ||||||||
Current breakdown | 10A | ||||||||
Peel strength | 1.4N/mm | ||||||||
Soldmask regidity | >6H | ||||||||
Thermal stress | 288℃20Sec | ||||||||
Testing voltage | 50-300v | ||||||||
Min buried blind via | 0.2mm(8mil) | ||||||||
Outer cooper thickness | 1oz-5oz | ||||||||
Inner cooper thickness | 1/2 oz-4oz | ||||||||
Aspect ratio | 8:1 | ||||||||
SMT min green oil width | 0.08mm | ||||||||
Min green oil open window | 0.05mm | ||||||||
Insulation layer thickness | 0.075mm-5mm | ||||||||
Aperture | 0.2mm-0.6mm | ||||||||
Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating |
PCB CAPABILITIES LIST | |||
Product Features | Standard | Advanced | Micro Electronics |
PC Board Attributes | |||
Min Layer count | 1 | 1 | 1 |
Max Layer Count | 24 | 26+ | 26+ |
Min Board Thickness | .010" | .004" | .004" |
Max Board Thickness | .200" | .200" + | .200" + |
Min Core Thickness | .002" | .002" | .002" |
Min Dielectric | .002" | .001" | .001" |
Min. Starting Copper Foil Weight | 9 micron | 3 micron | 3 micron |
Max. Finished Copper Thickness (O/L) | 6 oz | > 6 oz | .0015" |
Max. Finished Copper Thickness (I/L) | 4 oz | > 4 oz | .001" |
Maximum Panel Size | 21" x 29" | 21" x 29" | 12" x 18" |
Minimum Panel Size | 12" x 18" | 12" x 18" | 8" x 8" |
Smallest Mech Drill Diameter | .0059" | .004" | .004" |
Smallest Laser Drill Diameter | .0030" / .0080" | .0025" / .0100" | .0025" / .0100" |
Description
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantages:
1) We have professional research team.
2) No MOQ,small order are aslo welcome,From Prototype to Mass production.
3) All products are 100% tested working before sent to you.
4) One stop PCB solution
5) We have professional sales team, so please do not hesitate to contact us if you have any question