Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer

Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF100-10-02F Series
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Location: Dongguan Guangdong China
Address: No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer


Product description


TIF100-10-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features


> Excellent thermal conductivity: 1.0W/mK

> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

> Easy release construction
> Electrically isolating
> High durability


Applications


> Heat dissipation structure for radiators

> Telecommunication equipment

> Automotive electronics

> Battery packs for electric vehicles

> LED TV and lamps

> Telecommunication hardware

> Handheld portable electronics

> Semiconductor automated test equipment (ATE)

> CPU

> Display card
> Mainboard/mother board
> Notebook


Typical Properties of TIF100-10-02F Series
PropertyValueTest method
ColorGrayVisual
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity2.3 g/ccASTM D297
Hardness60 Shore 00ASTM 2240
Continuos Use Temp-40 to 160℃*****
Dielectric Breakdown Voltage(T-1.0mm)>5500 VACASTM D149
Dielectric Constant @ 1MHz4.0ASTM D150
Volume Resistivity1.0x1012 Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity1.0 W/m-KASTM D5470
Outgassing(TML)0.35%ASTM E595

Product Specification


Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied.Please contact us for confirming.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company profile


With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

China Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer supplier

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer

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