2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF540BS
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
TIFTM540BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features:
> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating
Applications
> Cooling components to the
> chassis of frame
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
| Typical Properties of TIFTM540BS | ||
| Color | Blue | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ******* |
| Density | 3.0g/cc | ASTM D297 |
| Thickness range | 1.0mmT | ASTM C351 |
| Hardness | 13 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Operating Temp | -45 ~200℃ | ******* |
| Dielectric Constant | 5.0 MHz | ASTM D150 |
| Volume Resistivity | ≥2.0X1013Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 2.6W/mK | ASTM D5470 |
Product Specifications
Standard Thickness:
0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size:
8"X16"(203 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided
hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for
materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.
For other thicknesses or moreinformation. please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
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