Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings
Brand Name:Ziitek
Certification:RoHs
Model Number:TS-TIR300L
Minimum Order Quantity:1000PCS
Delivery Time:2-3 work days
Place of Origin:China
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings
TIR®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt isideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.
Feature
> Excellent thermal impedance
> Replaces traditional thermal grease
> High reliability
> Easy to apply to surfaces
Application
> Between transistors and heat sinks
> Between mechanical structures
> Between heat sinks and externalcasings
| Typical Properties of TIR®300L series | |||
| Product Name | TIR®300L | Test Method | |
| Colour | Black | Visual | |
| Reinforcement Carrier | Aluminum | ***** | |
| Thickness range | 0.15 mm | ASTM D374 | |
| Hardness | 90 Shore 00 | ASTM D2240 | |
| Density | 1.4g/cc | ASTM D792 | |
| Volume Resistivity(ohm-cm) | 1*102 | ASTM D257 | |
| Continuous Use Temperature | -60℃~ 180℃ | Ziitek Test Method | |
| Thermal Conductivity(W/mK) | 2.5 | ASTM D5470 | |
| Thermal impedance(℃-in2/W)@30psi | 0.3 | ASTM D5470 | |
| Thermal impedance(℃-in2/W)@50psi | 0.25 | ASTM D5470 | |
| 180° Peel Strength | 1.0N/25mm | ASTM D3330 (Steel,Immediate) | |
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings
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