Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Brand Name:Ziitek
Certification:RoHs
Model Number:TIC800G
Minimum Order Quantity:1000PCS
Delivery Time:3-5days
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
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within 1 hours
Product Details
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Product Details
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
TIC®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°℃, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface,significantly improving heat dissipation performance.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV, Lighting
> Laptop computer
| Typical Properties of TIC®800G Series | ||||||
| Product Name | TIC®805G | TIC®806G | TIC®808G | TIC®810G | TIC®812G | Test Method |
| Color | Gray | Visual | ||||
| Thickness | 0.005" | 0.006" | 0.008" | 0.010" | 0.012" | ASTM D374 |
| (0.127mm) | (0152mm) | (0.203mm) | (0.254mm) | (0.305mm) | ||
| Density | 2.6g/cc | ASTM D792 | ||||
| Recommended Operating Temperature (℃) | -40℃～125℃ | Ziitek Test Method | ||||
| Phase Change Softening Temperature(℃) | 50℃~60℃ | Ziitek Test Method | ||||
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 | ||||
| Thermal Impedance(℃-cm²/W) @50 psi | 0.014 | 0.018 | 0.02 | 0.024 | 0.028 | ASTM D5470 |
Standard Thickness:
0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)
For other thickness options, please contact us.
Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.
Reinforcement Material: No reinforcement materialrequired.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
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