5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials
Brand Name:Ziitek
Certification:RoHs and UL
Model Number:TIS807-09-01
Minimum Order Quantity:1000PCS
Delivery Time:2-3Work days
Place of Origin:China
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials
TIS®807-09-01 Series of products are highly efficient insulating products and they also have thermal conductivity. it achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.
Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures
Applications:
> Car Battery & Power Supply
> Power semiconductors
> Audio and Video components
> Motor controllers
| Typical Properties of TIS®807-09-01 Series | ||
| Property | Value | Test Method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer /fiberglass | ****** |
| Thickness range | 0.007inch (0.178mm) | ASTM D374 |
| Tensile Strength(MPa) | 50 | ASTM D412 |
| Density | 2.4 g/cc | ASTM D297 |
| Continuos Use Temp | -60 to 180℃ | ****** |
| Breakdown Voltage(V/mm) | 3500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 5.5 | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 0.9W/m-K | ASTM D5470 |
| Thermal impedance(℃-in²/W)@30psi | 1.32 | ASTM D5470 |
Standard Thicknesses
0.007inch (0.178mm)
Standard Sizes
12" x 160"(304mm x 48.76M)
The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.
Packaging Details & Lead time
The packaging of silicone insulation materials
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials
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