Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF100C 10075-11
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Verified Supplier
Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules


TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:

> Excellent thermal conductivity 10.0W/mK

> Self-adhesive without the need foradditional surface adhesive
> Highly compressible, soft, and elasticAvailable in various thicknesses
> Good chemical stability


Applications:

> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)

> Industrial equipment
> Network communication devices

> New energy vehicles

Typical Properties of TIF®100C 10075-11 Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.3g/ccASTM D297
thickness0.020"(0.50mm)~0.200"(5.00mm)ASTM D374
Hardness (thickness<1.0mm)75 (Shore 00)ASTM 2240
Continuos Use Temp-40 to 200℃******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant5.5MHzASTM D150
Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity10.0W/m-KASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Product Specification
Product Thicknesses: 0.020"(0.50mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

China Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules supplier

Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

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