Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules 

Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF740QE
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Location: Dongguan Guangdong China
Address: No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules


The TIF740QE is an extremely soft gap filling material rated at a thermal conductivity of 8.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF740QE is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.


Features:


> Good thermal conductive:8.0 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Moldability for complex parts

> Available in varies thicknesses
> Broad range of hardnesses available


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

Typical Properties of TIF740QE Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.5g/ccASTM D297
thickness1.0mmASTM D374
Hardness35±10 (Shore 00)ASTM 2240
Continuos Use Temp-45 to 200℃******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant5.5MHzASTM D150
Volume Resistivity1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity8.0W/m-KASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

China Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules  supplier

Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules 

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