Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF100-16-38UF
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
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Product Details
Company Profile
Product Details
Manufacturer Supplier Custom Laptop 1.W 1mm 1.5mm 2mm 3mm Hard Drive Cpu GPU Thermal Gap Filler
The TIF100-16-38UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
TIF100-16-38UF-Series-Datasheet-rev3.pdf
Features:
> Good thermal conductive: 1.6 W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
Typical Properties of TIF100-16-38UF Series | ||||
Color | Pink | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.36 |
| 20mils / 0.508 mm | 0.41 | |||
Specific Gravity | 2.1 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.47 |
40mils / 1.016 mm | 0.52 | |||
Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.58 |
60mils / 1.524 mm | 0.65 | |||
Hardness | 65 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.72 |
80mils / 2.032 mm | 0.79 | |||
Tensile Strength | 45 psi | ASTM D412 | 90mils / 2.286 mm | 0.87 |
100mils / 2.540 mm | 0.94 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.01 |
120mils / 3.048 mm | 1.09 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.17 |
140mils / 3.556 mm | 1.24 | |||
Dielectric Constant | 5.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.34 |
160mils / 4.064 mm | 1.42 | |||
Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.50 |
180mils / 4.572 mm | 1.60 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.68 |
200mils / 5.080 mm | 1.77 | |||
Thermal conductivity | 1.6W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K
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