3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF1140-32-05US
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
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Product Details
3.2 W/mK High Tack Surface Reduces Contact Resistance Thermal pad for Notebook
The TIF1140-32-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-32-05US-Series-Datasheet-REV02.pdf
Features
> Good thermal conductive: 3.2 W/mK
>Thickness:3.5mmT
>hardness:20 shore 00
>Colour: blue
>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance
Applications
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
Typical Properties of TIF1140-32-05US Series | ||||
Color | blue | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific gravity | 3.0g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
| Thickness | 3.5mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
| Outgasing (TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 1.0X1012 Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 3.2 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
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