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New Developed Silicone Pads 94 V0 3.0 G/Cc For Micro Heat Pipe Thermal Solutions

New Developed Silicone Pads 94 V0 3.0 G/Cc For Micro Heat Pipe Thermal Solutions

Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF1140-30-11US
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Place of Origin:China
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Supplier`s last login times: within 1 hours
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Product Details Company Profile
Product Details

new developed silicone pads 94 V0 3.0 g/cc for Micro heat pipe thermal solutions


The TIF1140-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


TIF100-30-11US-Series-Datasheet-.pdf


Features


> Good thermal conductive: 3.0 W/mK

>Thickness:3.5mmT

>hardness:20±5 shore00

>Colour: gray

>Soft and compressible for low stress applications

>RoHS compliant

>UL recognized


Applications


>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card

>mainboard/mother board

>notebook


Typical Properties of TIF1140-30-11US Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


Standard Sheets Sizes:

8" x 16"(203mm x 406mm)


TIF™ series Individual die cut shapes can be supplied.


FAQ

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

China New Developed Silicone Pads 94 V0 3.0 G/Cc For Micro Heat Pipe Thermal Solutions supplier

New Developed Silicone Pads 94 V0 3.0 G/Cc For Micro Heat Pipe Thermal Solutions

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