UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules

Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF5180-50-11S
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
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Product Details

5W / MK,UL Recognized Thermal Conductive Gap Filler 4.5mmT,45 Shore00 With Grey Colour For RDRAM Memory Modules


5W / MK,UL recognized thermal conductive gap filler 45 shore00 with grey colour For RDRAM memory modules

The TIF5180-50-11US iis an extremely soft gap filling material rated at a thermal conductivity of 5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. The TIF5180-50-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

TIF500-50-11S Datasheet-REV02.pdf

Features:
> Good thermal conductive: 5.0W/mK
>Thickness:4.5mmT

>Soft and compressible for low stress applications

>Outstanding thermal performance

>Fiberglass reinforced for puncture, shear and tear resistance

>Electrically isolating


Applications:

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Semiconductor automated test equipment (ATE)

>CPU

>Memory Modules

>Mass storage devices

>Automotive electronics


Typical Properties of TIF5180-50-11S
Color

Grey

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber***10mils / 0.254 mm0.21
20mils / 0.508 mm0.27
Specific Gravity3.15 g /ccASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Thichness4.5mmT***

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness45 Shore 00ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp-40 to 160℃

***

110mils / 2.794 mm

1.00

120mils / 3.048 mm

1.07
Dielectric Breakdown Voltage>5500 VACASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant4.0 MHzASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity4.0X1012 Ohm-meterASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity5.0 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Advantage


Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract
China UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules supplier

UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules

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