High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF180-02F
Minimum Order Quantity:1000pcs
Delivery Time:3-5 days
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
Ziitek Electronic Material and Technology Ltd. is a R&D and
production company, we have many production lines and processing
technology of thermal conductive materials, owns advanced
production equipment and optimized process, can provide various
thermal solutions for different applications.
The TIF180-02F Series thermally conductive interface materials are applied to fill the
air gaps between the heating elements and the heat dissipationfins
or the metal base.Their flexibility and elasticity make them suited
tocoat very uneven surfaces. Heat can transmit to the metal housing
or dissipation plate from the heating elements or even the entire
PCB, which effecitly enhances the efficiency and life-time of the
heat-generating electronic components.
Features:
> Good thermal conductivity: 1.5 W/mK
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness
Application
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
Typical Properties of TIF180-02F Series | ||||
Color | Gray | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.48 |
| 20mils / 0.508 mm | 0.56 | |||
Specific Gravity | 2.3 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.71 |
40mils / 1.016 mm | 0.80 | |||
Heat Capacity | 1 l/g-K | ASTM C351 | 50mils / 1.270 mm | 0.91 |
60mils / 1.524 mm | 0.94 | |||
Hardness | 60 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 1.05 |
80mils / 2.032 mm | 1.15 | |||
Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 1.25 |
100mils / 2.540 mm | 1.34 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.43 |
120mils / 3.048 mm | 1.52 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.63 |
140mils / 3.556 mm | 1.71 | |||
Dielectric Constant | 4.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.81 |
160mils / 4.064 mm | 1.89 | |||
Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.98 |
180mils / 4.572 mm | 2.07 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 2.14 |
200mils / 5.080 mm | 2.22 | |||
Thermal conductivity | 1.5 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Product Thicknesses:
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x4O6mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
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