2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF3160
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated
The TIF3160 thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
Features:
> Perfect heat sinking
> Good thermal conductive: 2.8 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Thcikness: 3mmT
Applications:
> Automotive engine control units
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> Micro heat pipe thermal solutions
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment
> RDRAM memory modules
> Cooling components to the chassis of frame
Typical Properties of TIF™3160 | ||||
Color | gray | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 | |||
Specific Gravity | 2.41 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
40mils / 1.016 mm | 0.43 | |||
Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.50 |
60mils / 1.524 mm | 0.58 | |||
Hardness | 27 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
80mils / 2.032 mm | 0.76 | |||
Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 0.85 |
100mils / 2.540 mm | 0.94 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
120mils / 3.048 mm | 1.07 | |||
Dielectric Breakdown Voltage | >1500～>5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
140mils / 3.556 mm | 1.25 | |||
Dielectric Constant | 5.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
160mils / 4.064 mm | 1.38 | |||
Volume Resistivity | 6.3X1012Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
180mils / 4.572 mm | 1.50 | |||
Fire rating | 94 V-0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
200mils / 5.080 mm | 1.72 | |||
Thermal conductivity | 2.8 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated
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