High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF™340
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Place of Origin:China
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules
The TIF™340 is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF300 Series Datasheet-(E)-REV02-CRM.pdf
Features:
> Outstanding thermal performance: 3.0W/mK
> Moldability for complex parts
> Soft and Compressible for low stress applications
> RoHS compliant
>Easy release construction
>High durability
Applications
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
| Typical Properties of TIF™340 Series | ||
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone | ****** |
| Thinkness range | 0.020"(0.50mm~0.200"(5.0mm) | ASTM D374 |
| Hardness | 27±5 Shore 00 | ASTM 2240 |
| Specific Gravity | 3.05 g/cc | ASTM D792 |
| Continuos Use Temp | -40-160℃ | ****** |
| Dielectric BreakdownVoltage @ 1.0mm,AC(v) | ≥5500 | ASTM D149 |
| Dielectric Constant @MHz | 4.5 | ASTM D150 |
| Volume Resistivity(Ohm-cm) | ≥1.0X10¹² Ohm-meter | ASTM D257 |
| Thermal conductivity | 3.0 W/m-K | ASTM D5470 |
| Fire rating | V-0 | UL94 |
Product Thicknesses:
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8"x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal condauctive pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules
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