PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

Brand Name:Ziitek
Certification:RoHs
Model Number:TIA608P
Minimum Order Quantity:10SQM
Delivery Time:2-3Work day
Place of Origin:China
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times: within 1 hours
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Product Details

Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors


The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


Features


>Thermal Conductivity: 0.8 W/mK
>High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
>High performance, thermally conductive acrylic adhesive
>Fire rating equate 94 V0


Applications


>Mount heat sink onto BGA graphic processor or drive processor
>Mount heat spreader onto power converter PCB or onto motor control PCB
>High performance, thermally conductive acrylic adhesive
>Can be used instead of heat cure adhesive,screw mounting or clip mounting


Typical Properties of TIA608P Series
Typical PropertiesTIA608Ptest
ColorWhiteview
Adhesive TypeAcrylic Adhesive**********
Backing TypePET**********

Continuous

Use Temp

-45 °C to 120 °C**********
Thickness0.008" 0.203mmASTM D374
Voltage Breakdown> 1200 VacASTM D149
Thermal Conductivity0.8 W/mKASTM D5470
180°Peel Adhesion> 1200 g/inch (Steel, Immediate)PSTC-1
180°Peel Adhesion> 1400 g/inch (Steel after 24 hrs)PSTC-1
Holding Power (25 °C/Hours)> 48 HoursPSTC-7
Holding Power (80 °C/Hours)> 48 HoursPSTC-7
Fire ratingequate 94 V0*****

Standard Thicknesses:

0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)

Consult the factory alternate thickness.


Standard Sizes:

40" x 100'(1016mm x 30.48M) Individual die cut shapes can be supplied.


Reinforcement:

TIA™600P series The coil can be filled with PET.

China PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors supplier

PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

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