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2W/MK Heatsink Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies
The TIF100-20-10E Series thermally conductive interface materials are applied to fill the
air gaps between the heating elements and the heat dissipation fins
or the metal base. Their flexibility and elasticity make them
suited to the coating of the very uneven surfaces. Heat can
transmit to the metal housing or dissipation plate from the
separate elements or even the entire PCB, which in effect enhances
the efficiency and life-time of the heat-generating electronic
components.
Features:
> Good thermal conductive: 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> RoHS compliant
> UL recognized
> Easy release construction
Applications:
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
Typical Properties of TIF100-20-10E Series | ||
Property | Value | Test method |
Color | Gray | ****** |
Construction &Compostion | Ceramic filled silicone elastomer | ****** |
Specific Gravity | 2.7g/cc | ASTM D297 |
Outgassing(TML) | 0.40% | ASTM C351 |
Hardness | 35 Shore 00 | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 5.0 MHz | ASTM D150 |
Volume Resistivity | 4.0X10¹² Ohm-meter | ASTM D257 |
Flame rating | 94 V0 | equivalent UL |
Thermal conductivity | 2.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.