1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Brand Name:ziitek
Certification:RoHs
Model Number:TIS580-12
Minimum Order Quantity:25PC
Delivery Time:2-3 work days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
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Product Details
Company Profile
Product Details
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
TIS580-12 Series Datasheet-(E)-REV01.pdf
Feature
Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance
Application
It mainly used in substituting thermally-conductive paste and pads,
which currently finds in gap-filling adhesives or heat conduction
between LED aluminium motherboard and heat sink, high power
electrical module and heat sink. Traditional methods such as fins
and screws fixing can be replaced by applying TIS580-13, resulting
a more reliable gap-filling thermal conduction, simplified handling
and more cost-effective.E.g. Massive application in integrated
circuits in portable computer, microprocessor, high power LED,
internal storage module, cache, integrated circuits, DC/AC
translator, IGBT and other power modules, encapsulation of
semi-conductors, relay switches, rectifiers and transfomers
| Typical values of TISTM580-12 | ||
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.3 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7 | ***** |
| Elongation(%) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | ＞3.5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.2 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
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