2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF100-20-07E
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
Contact Now
Add to Cart
Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
The TIF100-20-07E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Good thermal conductive:2.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF™100-20-07E Series | ||||
Color | Green | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 | |||
Specific Gravity | 2.80 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
40mils / 1.016 mm | 0.43 | |||
Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.50 |
60mils / 1.524 mm | 0.58 | |||
Hardness | 45 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
80mils / 2.032 mm | 0.76 | |||
Tensile Strength | 55 ps | ASTM D412 | 90mils / 2.286 mm | 0.85 |
100mils / 2.540 mm | 0.94 | |||
Continuos Use Temp | -50 to 200℃ | *** | 110mils / 2.794 mm | 1.00 |
120mils / 3.048 mm | 1.07 | |||
Dielectric Breakdown Voltage | >10000 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
140mils / 3.556 mm | 1.25 | |||
Dielectric Constant | 7.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
160mils / 4.064 mm | 1.38 | |||
Volume Resistivity | 8X1012Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
180mils / 4.572 mm | 1.50 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
200mils / 5.080 mm | 1.72 | |||
Thermal conductivity | 2.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00
Inquiry Cart
0