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Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

Brand Name:Ziitek
Certification:RoHs
Model Number:TIC™808G series
Minimum Order Quantity:1000PCS
Delivery Time:3-5 work days
Place of Origin:China
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Supplier`s last login times: within 1 hours
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Product Details

Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow


TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


Applications Include:


> LED Lighting

> Thermal test stands

> DC/DC Converts

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

> Telecommunication


Features:


For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required


Typical Properties of TICTM800G Series
Product NameTICTM805GTICTM808GTICTM810GTICTM812GTest Method
ColorGrayGrayGrayGrayVisual
Thickness0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
0.012"
(0.305mm)
 
Thickness Tolerance±0.0008''
(±0.019mm)
±0.0008''
(±0.019mm)
±0.0012''
(±0.030mm)
±0.0012''
(±0.030mm)
 
Density2.6g/ccHelium Pycnometer
Temperature range-25℃~125℃ 
Phase Change Softening Temperature50℃~60℃ 
Thermal Conductivity5.0 W/mKASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa)0.014℃-in²/W0.020℃-in²/W0.038℃-in²/W0.058℃-in²/WASTM D5470 (modified)
0.09℃-cm²/W0.13℃-cm²/W0.25℃-cm²/W0.37℃-cm²/W

Standard Thicknesses:


0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.


Standard Sizes:


10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

China Low Temperature Melting  Phase Changing Materials PCM 5.0 W/mK  T-PCM  T558 Hi-Flow PCS Kenflow supplier

Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

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