Bonding bonder equipment

Bonding machine for LCD Refurbishment, Fog/FOB Bonding Machine, bonding equipment, bonding machine, FOB bonding machine, bonder machine, bonder equipment, 2014 hot selling! Mobile Phone LCD Bonding Machine OCA Glass Laminating Machine with Vacuum. 2014 Most Beautiful LCD Bonding Machine for LCD OCA Glass .Laminating for Iphone 4 5 Samsung S1 S2 S3 S4 S5 Note 1 Note 2 Note 3. Touch panel vacuum bonding machine bonding cover glass and lcd digitizer repair for iphone Samsung. DUAL-SIDE BONDED, LCD REPAIR MACHINE. Bonding Machine , Lcd Bonding Machine , FOG/FOB Bonding Machine , Bonding Machine Lcd Repair Machine FOG/FOB bonding machine XCM71-A6 1、The definition of FOG/FOB bonding machine XCM71-A6: FOG/FOB bonding machine referred to as "state machine" "hot press," using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached a ACF. use head pressure, head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF glue which is between the PCB so that it can conduct. 2、 About the application field of FOG/FOB bonding machine XCM71 - A6 FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as: television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises. 3、About the working principle of FOG/FOB bonding machine XCM71 - A6 Working principle of FOG / FOB bonding equipment XCM71-A5 is to using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached a ACF. use head pressure, head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF glue which is between the PCB so that it can conduct. 4、 About the FOG/FOB bonding machine XCM71 - A6's competitive advantage 6.1 Patent of sunsom(Patent No. ZL 201120120232.2): SUNSOM pressure system cylinder head structure can eliminate dead weight, pressure, minimum accuracy up to 0.1KG 6.2 Pressure head downward structure part USES the level 3 circuit control, according to quantitative production, manual production, production debugging needs to choose different control methods, has solved the past problem due to the different work mode press head downward inconvenience control . 6.3 Stepper, servo memory function and Automatically position the same amount of production equipment’s function used on the equipment subtly on the device solves any inconvenience caused by the big flat repeatedly move. 6.4 Own the qualification of equipment manufacturing enterprise in china which has a maximum size of flat panel display of FPD 5、About the basic parameters of FOG/FOB bonding machine XCM71 -A6 Input Power: AC220V 50-60Hz Working pressure :0.4-0 .8 Mpa Operating modes: 7-inch HMI Dimensions: L2210 × W1730 × H1500 mm The method of Heating: heating or pulse heating thermostat The quantity of Fixture: 2 group X-Y-θ micrometer adjustable Range of Temperature : RT-500 Control program: PLC controller Body main material: Steel + baking varnish The thermocouple: K type