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FR4 Immersion Gold PCB / Chip On Board Assembly with nice Epoxy Glop and high quality assured
Specifications:
1. PCB assembled chip on board
2. PCB prototype/PCB mass production and PCB assembly service
3. Competive Price and high quality
4, Surface Mount Technology
5. Through-Hole Assembly Technology
6. Convetional Leaded Technolgoy
7. Special Processes
8. RoHs
9. Inspection Methords
10. Conformal coating
11. Prompt and Superior Service
Detailed Specification of Pcb Assembly
1 | Type of Assembly | SMT and Thru-hole |
2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
3 | Components | Passives Down to 0201 Size |
BGA and VFBGA | ||
Leadless Chip Carries/CSP | ||
Double-Sided SMT Assembly | ||
Fine Pitch to 08 Mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement-Same Day Service | ||
3 | Bare Board Size | Smallest:0.25x0.25 Inches |
Largest:20x20 Inches | ||
4 | File Formats | Bill of Materials |
Gerber Files | ||
Pick-N-Place File(XYRS) | ||
5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment |
6 | Component Packaging | Cut Tape |
Tube | ||
Reels | ||
Loose Parts | ||
7 | Turn Time | 15 to 20 days |
8 | Testing | AOI inspection |
X-Ray inspection | ||
In-Circuit testing | ||
Functional test |
Quality Assurance:
ISO9001 and ISO/TS16949 management systems
Lean production system
ERP and PTS system support for management
Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
Testing:
AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming