500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven
Brand Name:YUSHUNLI
Certification:CE ISO
Model Number:YSF4/46
Minimum Order Quantity:1set
Delivery Time:10-15work days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Location:
Suzhou Jiangsu China
Address:
Building H, GuoRui Pioneering Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan, Suzhou,Jiangsu,China.
Supplier`s last login times:
within 48 hours
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Product Details
500 X 460 (Mm) Pcb Size High Quality Selective Soldering Flux Spray Module/Reflow Oven
Specification:
MODEL | YSF4/46 | YSS4/46 | |
Equipment parameters | Dimension(L×W×H) | 950 x 1776 x 1565 (mm) | 1700 x 1776 x 1565 (mm) |
Transport Parameters | Transport width adjustment | 50-460 (mm) | 50-460 (mm) |
PCB size | 500 x 460 (mm) | 500 x 460 (mm) | |
Conveyor height | 900±20(mm) | ||
The soldering system | Solder pot | electromagnetic pump tin solder pot | |
The amount of tin dross | 0.5KG/pot/week x1 | ||
Nitrogen consumption | 1.5-2m³/h/potx1 | ||
solder pot numbers | single pot/dual pots/dual pots individual control | ||
FLUX SPRAY MODULE
Introduction:
The spray head which is imported from Germany offers an absolutely
precise and well defined flux deposition on even the smallest
areas. The flux is targeted to beapplied only to the solder
joint,whereby the wettable area can be as small as 3mm.with the
effect that ionic contamination is minimized and flux consumption
is duced.
Features:
Saving 90%flux compared to traditional mode. The wettable area can
be as small as 3mm, minimize the effect of ionic contamination,
meanwhile boards cleaning free. Two axis servo motor control, high
positioning accuracy. Minimum ionic contamination.
Specifications: | |
Flux module x axis distance (max.) | 510mm |
Flux module y axis distance (max.) | 450mm |
Max. nozzle speed | 7m/min |
Flux content | 2 L |
Flux type | RO, RE and OR and with the effective standard of L0, L1, M0,
according to IEC 61190-1-1 |
Flux effective level | L0, L1, M0 |
Nozzle | 130 μm, alternative diameter |
Spray pressure | 0.5~1.0 bar |
Spray width | 2~8 mm (with spray nozzle 130 μm) |
Spray speed | 20 mm/s |
Positioning speed | 400 mm/s |
Positioning accuracy | ±0.2 mm |
Flux system | 2-axis With Servo Drive |
PREHEATING MODULE
Introduction:
The current selective soldering processes, in particular those for
lead-free soldering, multi-layer boards or high mass components,
call for increased preheat capacities. Short wave IR heater on the
bottom and hot air convective preheating on the top, toensure
preheating evenly.
Features:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the
efficiency.
3, Hot air convection preheating on the top, preheating more evenly
(optional).
Top heater power | 4KW |
Top heater voltage | 220V |
Bottom heater powerr | 4.8KW |
Bottom heater voltage | 220V |
CDA pressure | 0.5-0.7MPa |
SOLDERING MODULE
Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available
according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb
rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.
Specifications: | |
Solder nozzle position | Middle |
Solder content | 13 Kg |
Max. soldering temperature | 350 °C |
Min. internal diameter of solder nozzle | 3 mm, External Diameter 4.5 mm |
Max. Solder wave height | 5 mm |
Soldering speed X,Y-axis | 10 mm/s |
Positioning speed X,Y-axis | 200 mm/s |
Positioning speed Z-axis | 100 mm/s |
Positioning accuracy | ±0.15 mm |
Max.solder distance(x axis) | 510mm |
Max.solder distance(y axis) | 460mm |
Max.distance of z-axis | 58mm |
Max.pot moving speed | 5.8m/min |
Control system | 3-axis With Servo Drive |
500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven
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