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1. Usage
Precisive cutting of FPC and Membrane Keypads,organic membrane covering board without molds or the protection
plate. High-energy laser source and precise control of laser beams
can improve the processing speed and the accuracy of processing
results.
2. Characteristic
1. Independent intellectual property rights of the control
software, Humanized interface, complete functions and simple
operation.
2. Processing any graphic, cutting different thickness and
different materials, stratified processing and complete
synchronously
3. Adopt high-performance ultraviolet light laser with short wave
length, high beam quality and higher peak power properties. Because
ultraviolet light is through decomposition, vaporization instead of
melting to cutting the materials, so almost no burrs after
processing, small thermal effect, no stratification, precise
cutting effects, smooth, steep sidewall.
4. Fixed sample by using Vacuum mode, without matrix protection
plate, convenient and improving the processing efficiency.
5. Used for a variety of substrate materials cutting, such as:
Silicon, ceramics, glass, etc.
6. Automatic correction, automatic positioning and multi board
cutting function. Automatic board thickness measurement and
compensation. Full stroke motor compensation function. Improved
cutting accuracy, reduced horizontal vibration. Improved depth
cutting accuracy. Improved efficiency in cutting complex patterns.
UV Laser Cutting Machine USE:
The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer
board, as well as cutting a variety of substrates, such as ceramic, silicon etc.