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Feature:
1. Automatic correction, automatic positioning and multi board
cutting function. Automatic board thickness measurement and
compensation. Full stroke motor compensation function. Improved
cutting accuracy, reduced horizontal vibration. Improved depth
cutting accuracy. Improved efficiency in cutting complex patterns.
2. Processing any graphic, cutting different thickness and
different materials, stratified processing and complete
synchronously
3. Adopt high-performance ultraviolet light laser with short wave
length, high beam quality and higher peak power properties. Because
ultraviolet light is through decomposition, vaporization instead of
melting to cutting the materials, so almost no burrs after
processing, small thermal effect, no stratification, precise
cutting effects, smooth, steep sidewall.
4. Fixed sample by using Vacuum mode, without matrix protection
plate, convenient and improving the processing efficiency.
5. Used for a variety of substrate materials cutting, such as:
Silicon, ceramics, glass, etc.
6. Independent intellectual property rights of the control
software, Humanized interface, complete functions and simple
operation.
Usage :
1. Precision cutting of FPC and organic membrane covering board
2. without molds or the protection plate
3. High-energy laser source and precise control
4. of laser beams can improve the processing speed and the accuracy
of processing results.