PCB Laser Depaneling Machine with Optional 10/12/15/18W UV Laser

Brand Name:Chuangwei
Certification:CE
Model Number:CWVC-5S
Minimum Order Quantity:1 Set
Delivery Time:3 work days
Place of Origin:China
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Location: Shenzhen Guangdong China
Address: www.pcbseparator.com
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PCB Laser Depaneling Machine with Optional 10/12/15/18W UV Laser


PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.


Challenges of Depaneling using Routing/Die Cutting/Dicing Saws


Damages and fractures to substrates and circuits due to mechanical stress

Damages to PCB due to accumulated debris

Constant need for new bits, custom dies, and blades

Lack of versatility – each new application requires ordering of custom tools, blades, and dies

Not good for high precision, multi-dimensional or complicated cuts

Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.


Advantages of Laser PCB depaneling/singulation


  • No mechanical stress on substrates or circuits

  • No tooling cost or consumables.

  • Versatility – ability to change applications by simply changing settings

  • Fiducial Recognition – more precise and clean cut

  • Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.

  • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

  • Extraordinary cut quality holding tolerances as small as < 50 microns.

  • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards


Specification:


Parameter



Technical parameters

Main body of laser

1480mm*1360mm*1412 mm

Weight of the

1500Kg

Power

AC220 V

Laser

355 nm

Laser


Optowave 10W(US)

Material

≤1.2 mm

Precisio

±20 μm

Platfor

±2 μm

Platform

±2 μm

Working area

600*450 mm

Maximum

3 KW

Vibrating

CTI(US)

Power

AC220 V

Diameter

20±5 μm

Ambient

20±2 ℃

Ambient

<60 %

The Machine

Marble


Business Partners:

More information you wanna know,welcome to contact us:


WhatsApp/Wechat(Bunny): +86 136 8490 4990

www.pcb-soldering.com

Email:s5@smtfly.com

www.pcb-depanelizer.com

ChuangWei Electronic Equipment Manufactory

China PCB Laser Depaneling Machine with Optional 10/12/15/18W UV Laser supplier

PCB Laser Depaneling Machine with Optional 10/12/15/18W UV Laser

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