High density mobile phone Multilayer circuit board, 8 layer PCB boards

Brand Name:ZhenXian
Certification:UL E354810,SGS
Model Number:Mobile phone PCB board
Minimum Order Quantity:NO MOQ
Delivery Time:5-12Days
Payment Terms:T/T,OA, L/C, Western Union
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Location: Shenzhen Guangdong
Address: 7/F, High-Tech Park, Shangkeng Community, Guanlan Subdist., Baoan District, Shenzhen, Guangdong, China (Mainland)
Supplier`s last login times: within 1 hours
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Product Details

High density mobile phone Multilayer circuit board, 8 layer PCB boards


Description:

Place of Origin

Guangdong, China (Mainland)

Brand Name

Mobile phone circuit board

Model Number

Mobile phone PCB board

Number of Layers

8 layer PCB board

Base Material

CEM-3 FR-4

Copper Thickness

1/2 oz min 4 oz max

Board Thickness

0.2mm-3.20m(8mil-126mil)

Min. Hole Size

0.20mm(10mil)

Min. Line Width

0.075mm(3mil)

Min. Line Spacing

0.075mm(3mil)

Surface Finishing

HASL, HAL Pb Free, HAL, Immersion Gold, Gold Plating, Immersion Tin

Brand


Color

Green, red, white, blue, yellow

Certifications

ISO 9001:2008,ISO 14001:2004, UL, SGS, CTI


Feature:


1. Our PCBs are used for wide range of electronic products
Like Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box,Telecomunication ,LED, etc.
2. Provides OEM services to all sorts of printed circuit board assembly as well as Electronic encased products
3. Solder mask color: Green / Yellow / Black / White / Red / Blue.
4. Board material type: FR-4, Aluminium-backed board, Halogen-free, Lead-free compatible, High-Tg, High CTI, CEM-1, CEM-3, Rogers and more
5. Compound material lamination: 2 to 12 layers
6.Surface Finished type: HASL, Flash golds, ENIG,OSP(lead freecompatible), Carbon ink, Peelable S/M, HASL(lead free), Immersion silver/tin, Gold finger plating, ENIG+gold finger plating, Immersion Silver+gold finger plating



China High density mobile phone Multilayer circuit board,  8 layer PCB boards supplier

High density mobile phone Multilayer circuit board, 8 layer PCB boards

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