Business license check OK
1 - 10 Results for flip chip bonding from 2325 Products
SiC Ceramic Vacuum Chuck Flip-Chip Bonding Mirror Polishing High-Stiffness
SiC Ceramic Vacuum Chuck Abstract SiC Ceramic Vacuum Chuck Flip-Chip Bonding Mirror Polishing High-Stiffness A Flip-Chip Bonding Vacuum Chuck is a high-precision vacuum adsorption component specifically designed for Flip-Chip Bonding processes in semiconductor manufacturing. Its core function is to stably adsorb and secure wafers or dies during bonding, ensuring micrometer or even sub-micrometer-level alignment and interconnection...
SHANGHAI FAMOUS TRADE CO.,LTD
Verified Supplier
Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
Ultra-Thin 0.07mm RFID Inlay with 10 Years Data Storage and Flip Chip Bonding for High Performance
RFID RFID Classic(R) 1K label tag RFID Dry inlay/wet inlay Frequency HF 13.56MHz Inlay Size Dia 21mm Wet Inlay Size Dia 25mm Chip RFID Memory 144/504/888bytes Antenna Aluminium etching antenna Bonding Flip chip Unwinding chip side up Thickness 0.07mm Reading Distance 1.5~3cm (depends on reader applied) Operation Temp. -20°C~+65°C Storage Temp. -25°C~+65°C Date Storage ≥10 years Packing 10,00pcs/roll each roll in a inner case , 4 rolls per master...
White Smart Co., Limited
Verified Supplier
508room,D building,minle industrial area,longhua district,shenzhen.
45x45mm HF RFID Inlay with Flip Chip Bonding and Aluminium Antenna for Key Fob Applications
45*45mm HF RFID Inlay NFC wet inlay PET material for paper card / key fob Frequency HF 13.56MHz Label Size 45*45mm Wet Inlay Size 45*45mm Chip RFID Classic ® RFID ® ® Antenna Aluminium etching antenna Bonding Flip chip Unwinding chip side up Thickness 0.07mm Operation Temp. -20°C~+65°C Storage Temp. -25°C~+65°C Date Storage ≥10 years Packing 10,00pcs/roll each roll in a inner case , 4 rolls per master ctn Samples upon request Declare The showing...
White Smart Co., Limited
Verified Supplier
508room,D building,minle industrial area,longhua district,shenzhen.
ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine
ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip Bonder Machines. Infinite Automation...
INFINITE AUTOMATION CO ., LIMITED
Verified Supplier
Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China
Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine
Fully Automatic Smt Production Line Flip Chip Die Bonder Machine For COB Strip Light and Semiconductor Packaging Chip Mounting Electronics Machinery High-Speed Flexible Strip Die Bonder Product Features 1. Utilizes a sheet-to-sheet docking station with dual swing arms for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and...
Shenzhen Hongxinteng Technology Co., Ltd.
Verified Supplier
Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.
200W - 300W Multichip RGBW LED Engines with Eutectic Bonding Flip - Chip
200W - 300W Multichip RGBW LED Engines with Eutectic Bonding Flip - Chip Multichip RGBW LED Engines 200W-300W with Eutectic Bonding Flip-Chip Products’ Features: 1, Small LES, 5W/mm² ; 2, Eutectic Flip-chip bonding, Thermoelectric solution, fast heat-conductivity 3, Special Parallel and Serial connection, Lower Forward Current, Lower heat-emission 4, Average efficiency upto 40lm/W @Tj=85℃ with full power; 5, Excellent effect of color-mixing for...
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
No.15-1,JinGu Road South,Huadong Town,Huadu District, Guangzhou P.R.China 510890
300W RGBW Multichip LED Engine , Flip-chip Cree White High Power LED Emitters
300W RGBW Multichip LED Engine,Flip-chip Cree White High Power LED Emitters Products’ Features: 1, Small LES, 5W/mm² , High Power and high light density for spot lighting,far distance projection illumination 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity betweeb LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat...
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
No.15-1,JinGu Road South,Huadong Town,Huadu District, Guangzhou P.R.China 510890
520 - 530nm RGB Led Light Module 250W for Medical Lighting , Eutectic Flip - chip
520 - 530nm RGB Led Light Module 250W for Medical Lighting , Eutectic Flip - chip Features: 1, Small LES, 5W/mm² 2, Eutectic flip-chip bonding technique 3, Higher Forward Voltage, Lower Forward Current, 4, Average efficiency upto 40lm/W @Tj=85℃ with full power 5, Excellent effect of color-mixing for 3 Colors or 4 Colors LEDs light source 6, Copper MCPCB, high thermal conductivity Specifications: Code Color Vf (V) If (A) λd(nm) CCT(K) φv(lm) Power...
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
No.15-1,JinGu Road South,Huadong Town,Huadu District, Guangzhou P.R.China 510890
Flip-Chip RGB LEDs Engine Emitter 250W with High Efficiency and Uniformity
Flip-Chip RGB LEDs Engine Emitter 250W with High Efficiency and Uniformity LED Emitter Light Engine RGB 250W Features: 1, Small LES, 5W/mm² 2, Eutectic flip-chip bonding technique 3, Higher Forward Voltage, Lower Forward Current, 4, Average efficiency upto 40lm/W @Tj=85℃ with full power 5, Excellent effect of color-mixing for 3 Colors or 4 Colors LEDs light source 6, Copper MCPCB, high thermal conductivity Specifications: Code Color Vf (V) If (A)...
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
No.15-1,JinGu Road South,Huadong Town,Huadu District, Guangzhou P.R.China 510890
520 - 530nm RGB Led Light Module 250W for Medical Lighting , Eutectic Flip - chip
520 - 530nm RGB Led Light Module 250W for Medical Lighting , Eutectic Flip - chip Features: 1, Small LES, 5W/mm² 2, Eutectic flip-chip bonding technique 3, Higher Forward Voltage, Lower Forward Current, 4, Average efficiency upto 40lm/W @Tj=85℃ with full power 5, Excellent effect of color-mixing for 3 Colors or 4 Colors LEDs light source 6, Copper MCPCB, high thermal conductivity Specifications: Code Color Vf (V) If (A) λd(nm) CCT(K) φv(lm) Power...
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
No.15-1,JinGu Road South,Huadong Town,Huadu District, Guangzhou P.R.China 510890
Submit “flip chip bonding” inquiry
This supplier has been verified by Everychina.com. Our verification process includes: 3 on-site visits by Everychina.com's service team!
Business license check OK
