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1 - 10 Results for electronic packaging from 23202 Products
Waterproof Lamination Scratch Resistant Film Hot Stamping Spot UV For Packaging Box
Scratch Resistant Waterproof Lamination Film Hot Stamping Spot UV For Packaging Box • Raw Material:Wet LaminationFilm:BOPP；Thermal Lamination Film:BOPP+EVA • Surface treatment: Double side treatment • Thickness: 18mic,28mic • Width: 200-1700mm • Application:Scratch Resistance book cover,Menu,cosmetics box,shoe box,3C electronic packaging box. Item Scratch Resistant Waterproof Lamination Film Hot Stamping Spot UV For Packaging Box Length 200-4000m...
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
Verified Supplier
Tengjin Technology Park,No.7,Huaguoshan Road,XinAn community,ChangAn,Dongguan,GuangDong,China.
75um PET single side silicone coated release films, used as protetive films in electronic, packaging, labeling, taping.
75 micron PET film in green color has various applications in different industries. Here are some of the main applications of green PET film: 1. Packaging: PET film in green color is widely used for packaging applications in different industries. The film's green color can attract consumers and make packaging more visually appealing. It can be used for packaging food products, beverages, cosmetics, and more. 2. Decorative materials: PET film in...
Shanghai HSF Materials Technology Co., Ltd.
Verified Supplier
Area D, No. 218 North Huting Road, Songjiang, Shanghai
18mic Lamination Anti Scratch Film Spot UV For Packaging Box Hot Stamping
18mic Lamination Anti Scratch Film Spot UV For Packaging Box Hot Stamping • Raw Material: Wet LaminationFilm:BOPP; Thermal Lamination Film:BOPP+EVA • Surface treatment: Double side treatment • Thickness: 18mic,28mic • Width: 200-1700mm • Application: Scratch Resistance book cover,Menu,cosmetics box,shoe box,3C electronic packaging box. Item 18mic Lamination Anti Scratch Film Spot UV For Packaging Box Hot Stamping Length 200-4000m Thickness 18mic,...
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
Verified Supplier
Tengjin Technology Park,No.7,Huaguoshan Road,XinAn community,ChangAn,Dongguan,GuangDong,China.
Sensor IC MAX31875R2TZS I2C Temperature Sensor In WLP Package
Sensor IC MAX31875R2TZS I2C Temperature Sensor In WLP Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% Low Price Guaranteed + Export to 108 countries, customer satisfaction rate: 99.9% !! [Company profile] Shenzhen Mingjiada Electronics Co., Ltd. is an authorized independent distributor of electronic components of world-renowned brands. Founded in...
ShenZhen Mingjiada Electronics Co.,Ltd.
Verified Supplier
1239 New Asia Guoli Building Zhenzhong Road.,Futian district Shenzhen China
Economic Desktop External Vacuum Packing Machine For PCB Package
Economic Desktop External Vacuum Packing / Sealing Machine for PCB Package Introduction This vacuum packing machine called desktop external vacuum packing machine, made of painted shell, or customized stainless steel, suitable for packing IC, electronic components, PCB board, optoelectronic parts, hardware products, like LED lamp, PCB, FPC, taped IC, Reel packaged IC, and plastic packaged or trays packaged smart phone screen, tablet screen, touch...
Shenzhen Hansome Technology Co., Ltd.
Verified Supplier
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Microwave Molybdenum Copper Alloy Sheet Electronic Packaging Materials Packaging Materials Copper Alloy Sheet
Molybdenum and Copper For Use In Electronic Packaging Materials, Use Copper Alloy Sheet. 1. A Description Of Copper Alloy Sheet With Molybdenum For Use In Electronic Packaging Materials Copper molybdenum copper sheet, also known as CMC material, is a metal-based plane layered composite electronic packaging material. Its core is made of pure molybdenum, and its exterior is either coated in pure copper or copper that has undergone dispersion...
Shaanxi Peakrise Metal Co.,Ltd
No.188 Gaoxin Road,Weibin District Baoji City, Shaanxi ,China 7210013
W70Cu Tungsten Copper Alloy Electronic Package Plate Sheet Copper Tungsten Electrode Material
W70Cu30 Tungsten Copper Alloy Electronic Package Sheet Metal Electrode 1. W70Cu30 Tungsten Copper Alloy Electronic Package Sheet Metal Electrode : Tungsten copper encapsulation sheet and heat sink material have both the low expansion characteristics of tungsten and the high thermal conductivity of copper. Wide range of applications. W70 tungsten copper encapsulation sheet, as the name suggests, is a material composed of 70% tungsten and 30%...
Shaanxi Peakrise Metal Co.,Ltd
No.188 Gaoxin Road,Weibin District Baoji City, Shaanxi ,China 7210013
Tungsten Copper Alloy Electronic Packaging Sheet High Density 11.9 - 17.3g/Cm3
Product Description: Tungsten copper alloy electronic packaging sheet is a material used in electronic packaging and thermal management. It is usually composed of two metals, tungsten and copper, and is made by powder metallurgy or other processing methods. Tungsten copper alloy is characterized by good thermal conductivity and high thermal expansion coefficient. Tungsten has a very high melting point and excellent thermal conductivity, while...
Shaanxi Peakrise Metal Co.,Ltd
No.188 Gaoxin Road,Weibin District Baoji City, Shaanxi ,China 7210013
WCu25 WCu30 Diameter 5 - 50mm Tungsten Copper Alloy Bar For Electronic Packaging Aerospace
WCu25 WCu30 Diameter 5~50mm Tungsten Copper Alloy Bar For Electronic Packaging 1. Information Of WCu25 WCu30 alloy bar: WCu25 and WCu30 are common tungsten-copper alloy rod materials, which are mainly composed of tungsten and copper, with high density and good thermal conductivity. 2. Size Of WCu25 WCu30 alloy bar: WCu25 and WCu30 generally have different diameter and length dimensions. WCu25: diameter 2-100mm, length 50-500mm; WCu30: diameter 5...
Shaanxi Peakrise Metal Co.,Ltd
No.188 Gaoxin Road,Weibin District Baoji City, Shaanxi ,China 7210013
Custom Copper Molybdenum Microelectronic Material MoCu Alloy Electronic Package Sheet
Application Of Molybdenum Copper Alloy As Microelectronic Material 1. Description Of Molybdenum Copper Alloy As Microelectronic Material: Molybdenum-copper alloy (MoCu a molybdenum-copper and tungsten-copper, both have low expansion characteristics (the thermal expansion coefficient of molybdenum is 5.0x10-6/℃, the thermal expansion coefficient of tungsten is 4.5x10-6/℃), and it has the high thermal conductivity of copper. , its thermal expansion...
Shaanxi Peakrise Metal Co.,Ltd
No.188 Gaoxin Road,Weibin District Baoji City, Shaanxi ,China 7210013
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