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Advanced Smd Pcb Assembly , Smt Printed Circuit Board Assembly 0.25mm Pitch BGA

Advanced Smd Pcb Assembly , Smt Printed Circuit Board Assembly 0.25mm Pitch BGA

Brand Name:FUCO
Certification:UL, ISO, RoHS, TS16949
Model Number:FR4
Minimum Order Quantity:1
Delivery Time:2-30 days
Payment Terms:L/C, T/T
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Location: Huizhou Guangdong China
Address: Liwu Industrial Zone, Yuanzhou Town, Boluo, Huizhou City, Guangdong, China
Supplier`s last login times: within 21 hours
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Product Details

Advanced Printed Circuit Board Assembly SMT SMD Assembly 0.25mm Pitch BGA

PCB Assembly Specification:

PCB typePCBA
Numbers of layersMulti layer
Build time2-30 days(expedited service)
MaterialFR4, Aluminium, FR1, CEM1, CEM3, Ceramic, FPC
Board size70x50mm
Board size tolerance±0.1mm - ±0.3mm
Board thickness1.6mm
Board thickness tolerance±0.1mm - ±10%
Copper weight3.5oz
Inner layer copper weight0.5-2.0oz
Copper thickness tolerance+0um-+20um
Min tracing /spacing3mil
Solder mask sidesAs per request
Solder mask colourGreen, Blue, Black, White, Red, Yellow
Silkscreen colourWhite, Black, Yellow, Red
Surface finish

HASL-Hot air solder leveling

Lead free HASL-RoHS

ENIG-Electroless nickel electroless palladium immersion gold - RoHS

Immersion silver - RoHS

Immesrion tin -RoHS

OSP - Organic Solderability Presservatives - RoHS

Min Annular Ring3mil
Min drilling hole diameter6mil, 4 mil-laser drill
Min width of cutout(NPTH)0.8mm
NPTH hole size tolerance±0.05mm
Min width of slot hole(PTH)0.6mm
PTH Hole size tolerance±0.08 - ±0.15mm
Surface/Hole plating thickness20-30um
SM Tolerance(LPI)0.075mm
Aspect Ratio1:10(hole size:Board thickness
SMD pitch0.2mm
BGA pitch0.2mm
Chamfer of gold fingers20,30,45,60
Other techniques

Gold fingers

Blind and buried holes

Peelable solder mask

Edge plating

carbon mask

Kapton tape

Countersink/counterbore hole

Half-cut/castellated hole

Press fit hole

Via tented/covered with resin

Via plugged/filled with resin

Via in pad

Electrical test


For PCBA order, provide us:
1. PCB Gerber file
2. BOM list for PCBA
3. Sample of PCB and PCBA
4. Test method for PCBA


PCB Assembly Capability:

1. PCB assembly min IC pitch 0.30mm (12mil)

2. PCB assembly foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA

3. PCB assembly min chip placement 01005

4. PCB Assembly Max PCB Size 410 x 600mm (16.2 x 23.6″)

5. PCB assembly min PCB thickness 0.35mm (13.8mil)

6. PCB assembly maximum BGA size 74 x 74mm (2.9 x 2.9″)

7. PCB assembly BGA ball pitch 1-3mm (4-12mil)

8. PCB assembly BGA ball diameter 0.4-1mm (16-40mil)

9. PCB assembly QFP lead pitch 0.38-2.54mm (15-100mil)

10. PCB assembly packing Anti-static bubble bag and carton

PCBA Packaging & Delivery
Packaging Details
One pc in one bubble pack
Delivery Time
Within 2~3 weeks after deposit

PCB Board Manufacturing Equipments:

Our Advantages:

1.No MOQ
2.11 years of PCB&PCBA turnkey services
3.Quick turn, Prototype, Low & medium & high volume
4.Components sourcing,ODM&OEM services provide
5.ISO 14001-, ISO/TS 16949,UL, RoHS certified
6.100% E-test,100% visual inspection, including IQC, IPQC, FQC and OQC
7.100% AOI inspection, including X-ray, 3D microscope and ICT
8.Fast response within 24 hours,great pre-sales, sales, after-sales
9.All kinds of Export/Import Processing Support,EX-Factory, FOB HK, FOB Shenzhen, and DDU by express
10.All kinds of payment:T/T,Paypal,WesternUnion
11.Guarantee Sales Service,for all problems encountered kindly contact us, we will do the after service any time.

China Advanced Smd Pcb Assembly , Smt Printed Circuit Board Assembly 0.25mm Pitch BGA supplier

Advanced Smd Pcb Assembly , Smt Printed Circuit Board Assembly 0.25mm Pitch BGA

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