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Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-481.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Supplier`s last login times: within 1 hours
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Product Details Company Profile
Product Details
Multi-layer Printed Circuit Board 8 Layer PCB Board Built on Tg170 FR-4 With Immersion Gold for Wireless Communication.
1.1 General description
This is a type of 8 layer printed circuit board built on FR-4 Tg170 substrate for the application of Wireless Communication. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supply 1 up board per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
1.2 Features and benifits
Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
High solderability, no stressing of circuit boards and less contamination of PCB surface.
Electrical test and high voltage test
Quick and on-time delivery
Money-saving, Worry-saving and Labor-saving
Free-of-charge PCB prototype test
1.3 Applications
Video Surveillance
Converters
Electrical Converter
Embedded System Applications
1.4 Parameter and data sheet
Number of Layers8
Board TypeMultilayer PCB
Board size210.72 x 212.42mm=1UP
Board Thickness1.60 mm +/-0.16
Board MaterialFR-4
Board Material SupplierITEQ
Tg Value of Board Material170℃
PTH Cu thickness≥20 um
Inner Iayer Cu thicknes35 um (1oz)
Surface Cu thickness35 um (1oz)
Solder Mask Type and Model No.LPSM, PSR-2000GT600D
Solder Mask SupplierTAIYO
Solder Mask ColourGreen
Number of Solder Masks2
Thickness of Solder Mask14 um
Type of Silkscreen InkIJR-4000 MW300
Supplier of SilkscreenTAIYO
Color of SilkscreenWhite
Number of Silkscreen1
Mininum Trace (mil)5.8 mil
Minimum Gap(mil)5.4 mil
Surface FinishImmersion Gold
RoHS RequiredYes
Warpage0.25%
Thermal Shock TestPass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity TestPass, 255±5℃,5 seconds Wetting Area Least 95%
Function100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)
T10.450
T20.600
T30.800
T40.900
T50.950
T61.000
T71.250
T81.300
T91.400
T101.600
T111.700
T122.000
T132.550
T143.000
T153.250
T163.500
1.5 Design For Manufacture (5)
Serial NO.ProcedureItemManufacturing capability
Large volume (S<100 m²)Middle volume (S<10 m²)Prototype(S<1m²)
66Contour processMethod of contour processCNC milling, V-CUT, Break-out tap, break-out holes, Punching
67Minimum router0.8mm
68Min.tolerance of contour±0.15mm±0.13mm±0.1mm
69Min.distance of milling contour(no copper exposure)12mil10mil8mil
70Angle of V-CUT20,30,45,60 ±5 degree
71Degree of symmetry of V-CUT±6mil±5mil±4mil
72Tolerance of residual thickness of V-CUT±6mil±5mil±4mil
73Tolerance of Chamfer angle of Gold finger±5 degree±5 degree±5 degree
74Tolerance of residual thickness of bevel edge of gold finger±5mil±5mil±5mil
75Min radius of inner corner0.4mm
76Min. distance from edge to V-Cut (no copper exposure)18mil (1.6mm Thick, 20 degree V-groove cutter)14mil(1.6mm Thick, 20 degree V-groove cutter)12mil (1.6mm Thick, 20 degree V-groove cutter)
7720mil (1.6mm Thick, 30 degree V-groove cutter)18mil (1.6mm Thick, 30 degree V-groove cutter)16mil (1.6mm Thick, 30 degree V-groove cutter)
7824mil (1.6mm Thick, 45 degree V-groove cutter)22mil (1.6mm Thick, 45 degree V-groove cutter)20mil (1.6mm Thick, 45 degree V-groove cutter)
7930mil (1.6mm Thick, 60 degree V-groove cutter)28mil (1.6mm Thick, 60 degree V-groove cutter)26mil (1.6mm Thick, 60 degree V-groove cutter)


China Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board supplier

Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

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