led light circuit board design
Brand Name:XUANCAI
Certification:CE ROHS LM-80
Model Number:300W SMD PCB Board
Minimum Order Quantity:100 PCS
Delivery Time:4-6 days
Payment Terms:T/T, Western Union, Paypal , Alibaba trade assurance
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Location:
Shenzhen Guangdong China
Address:
3/F, F Building, Maoyuan Industrial Area, Guanlan Longhua New Zone, Shenzhen, Guangdong, China
Supplier`s last login times:
within 10 hours
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Product Details
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Product Details
High power round 200W 250W 300W led smd 3030 on pcb board 130-140 LM/W for high bay light with 3 Years' Warranty
Product Description
Specification
- LEDs Type: 300W SMD PCB Board
- Product Size: 190mm
- Wattage: 300W
- Curremt: 1500-1800mA
- Voltage: 150V
- Luminous: 130-150lm/W
- Color Rendering Index: 70 / 80
- Chip: SMD 3030
- Aluminum substrate thickness:2.0mm
- Thermal conductivity of aluminum substrate :2.0W
- Material: Gold Wire
- Chip Brand: US Bridgelux Chip
Related products Parameters
| The scope of products | Specification | Series-Parallel | Current /Voltage | Luminous Efficacy | Luminous Efficacy |
| High bay light | 100 WΦ150MM | 10B5 C*2 | (1500MA 30V) * 2 | 130-140LM/W | 140-150LM/W |
| 150 WΦ150MM | 10B5 C*3 | (1500MA 30V) * 3 | 130-140LM/W | 140-150LM/W | |
| 200 WΦ190MM | 10B5 C*4 | (1500MA 30V) * 3 | 130-140LM/W | 140-150LM/W | |
| 250 WΦ190MM | 10B5 C*5 | (1500MA 30V) * 5 | 130-140LM/W | 140-150LM/W | |
| 300 WΦ190MM | 10B5 C*6 | (1500MA 30V) * 6 | 130-140LM/W | 140-150LM/W | |
| 100 WΦ150MM | 50C 2B | 600MA 150V | 130-140LM/W | 140-150LM/W | |
| 150 WΦ150MM | 50C 3B | 900MA 150V | 130-140LM/W | 140-150LM/W | |
| 200 WΦ190MM | 50C 4B | 1200MA 150 V | 130-140LM/W | 140-150LM/W | |
| 250 WΦ190MM | 50C 5B | 1500MA 150 V | 130-140LM/W | 140-150LM/W | |
| 300 WΦ190MM | 50C 6B | 1800MA 150 V | 130-140LM/W | 140-150LM/W |
Application
High Bay light/ Chandeliers/ Tower pendant lamp/ Flood light
User Manuel
The soldering precautions
Soldering conditions: Reflow soldering is not recommended for this LED. If hand soldering, set sol-dering iron temperature at 350℃ and soldering time not More than 5 seconds, after the first soldering, make sure the substrate surface temperature returns to ambient temperature before a second soldering. Please. make sure when soldering, there is no external force on the soldering surface and silicon batardeau (such as pressure, friction or sharp metal nails, etc.), to avoid gold wire deformation or dam-age and other abnormalities. If beyond recommended conditions, we cannot guarantee the LED stability, please do the risk assessment first. During assembly, please ensure that a good quality thermal paste is applied and distributed evenly over the surface. While using thermal pad (Heat Sink), make sure LED is firmly tightened and there is no gap between surfaces. In such heat-media products, through a pressure test of at least 500 volts.
Anti-static measures
Please take adequate measures to prevent electrostatic generation, such as wearing electrostatic ring or anti-static fingerstall etc; any relative products like plant equipment, machinery, carrier and transpor-tation units shall be connected to discharging unit/ ground. The ESD sensitivity of this product is > 1000V(HBM), after assembly the final lamp, please make sure to discharge Static Electricity by proper ESD equipment.
Temperature control
Recommended temperature conditions for enhanced product life: Be sure to TS point (negative pads) controlled below 85℃, COB recommendation colloid surface temperature control ≤150℃.
The drive control
Drive this product at constant current. Output current range specifications should be ac-cording to the operational and other conditions, as mentioned in data sheet. Before using a constant voltage source or altered specifications other than recommended, please consider risk factors.
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