1.25 Pitch Wafer Housing Terminal 2P Right Angle DIP Wire To Board Connector
Brand Name:WCON
Certification:UL/CUL/SGS/ROHS
Model Number:WF1254-WZXXXX1
Minimum Order Quantity:1000pcs
Delivery Time:15-25 Working Days
Payment Terms:T/T
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
No.01A, Changxing Road, Ludong District, Humen Town, Dongguan, Guangdong. 523935. China.
Supplier`s last login times:
within 42 hours
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Product Details
1.25 Pitch 2P Right Angle DIP Wafer Wire To Board Connector board to wire connectors
1. Rated Voltage:125V AC/DC
2. Rated Current:1.0AMP
3. Contact Resistance:20mΩ Max
4. Withstand Voltage:500V AC/DC
| Insulation Resistance | 100mΩ Min |
| Operation Temperature | -25℃ to +85℃ |
| Contact Material | Brass |
| Contact Plating | Au Or Sn Over Ni |
| Insulator Material | PA6T+30%GF UL94V-0 |
Product Name: Wafer connector
1. Features: it makes the production process more convenient, more flexible design, reduces the
production and maintenance cost, easy repair, and easy to upgrade, improve the flexibility of design
2. Material: (UL94V-0) PA9T, PA6T, PA46, PA66 etc.
3. Scope of application: used in computer and peripheral equipment, communication products, test instruments, consumer electronics products, automotive industry, medical and electronic products production, military and aerospace industry in which the device connecting the two active devices, current or signal transmission. Industrial automation unmanned aerial vehicle (uav)
1.25 Pitch Wafer Housing Terminal 2P Right Angle DIP Wire To Board Connector
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