1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Brand Name:Ziitek
Certification:RoHS
Model Number:TIS580-12
Minimum Order Quantity:10kg
Delivery Time:3-8 work days
Payment Terms:T/T
Contact Now
Add to Cart
Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Supplier`s last login times:
within 2 hours
Shipping
lt's easy to get a shipping quote! Just click the button below and complete the short form.
Get Shipping Quote
Product Details
Company Profile
Product Details
Room temperature cured thermal conductive silicone adhesive Low shrinkage and viscosity
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.
TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.
TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
TIS580-12 Series Datasheet-(E)-REV01.pdf
Feature
> Good thermal conductivity: 1.2W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
It mainly used in substituting thermally-conductive paste and pads,
which currently finds in gap-filling adhesives or heat conduction
between LED aluminium motherboard and heat sink, high power
electrical module and heat sink. Traditional methods such as fins
and screws fixing can be replaced by applying TIS580-12, resulting
a more reliable gap-filling thermal conduction, simplified handling
and more cost-effective.
E.g. Massive application in integrated circuits in portable
computer, microprocessor, high power LED, internal storage module,
cache, integrated circuits, DC/AC translator, IGBT and other power
modules, encapsulation of semi-conductors, relay switches,
rectifiers and transfomers
Typical values of TISTM580-12 | ||
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.2 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 5000 cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7 | ***** |
| Elongation(%) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | ＞3.5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.2 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Package:
300ml/tube
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Inquiry Cart
0