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SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon

SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon

Brand Name:Unicomp
Certification:CE, FCC
Model Number:AX9100
Minimum Order Quantity:1
Delivery Time:45 days
Payment Terms:T/T
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Supplier`s last login times: within 1 hours
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Product Details Company Profile
Product Details
  • Application
  • Semiconductor, Packaging components, Battery Industry,
  • Electronic components, Automotive parts, Photo-voltaic,
  • SMT, BGA, CSP, Flip Chip, LED Detection
  • Aluminium Die-casting, Moulding Plastic.
  • Ceramics, other special industries.



  • Features
  • 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD
  • X-ray tube & detector automatic lifting and descending, with convenient target point positioning system
  • Multi-function DXI image processing system, CNC programmable detection
  • Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification
  • Tilt detection with 55° and rotation 360°operation together with 6 axis movement



  • X-ray Images


  • Technical Specifications

ItemDescriptionSpecifications
X-Ray TubeMax. Voltages, Type130kV (Option 110KV), Closed
Power Consumption40W(25W)
Focal Spot Size7 μm
Magnification1600X
DetectorDetector TypeFPD
Resolution101 LP/cm
Effective Area116.4mm ×145.7mm
System ComputerOperating SystemIndustrial PC, Win 7, i7 Processor
Monitor22” LCD
SoftwareUser InterfaceUnicomp Multi-function DXI image processing system
Working PlatformMax. Loading Areaφ570mm
Max. Inspection Area450mm×450mm
Max. Loading Weight10kg
Movement ControlJoysticks, Mouse and Keypads
Motion Range (Up and Down)200mm
Table Tilting Angle55° Tilting and 360° Rotation
NavigationCameraHD Camera, Laser point
AxisManipulator6-axis with X1/ X2 / Y / Z / T(55°) / R(360°)
Equipment FeaturesPower SupplyAC 110~220V (±10%) 50Hz, 2.0kW
Outline Dimensions1450(W)×1500(D)×1850(H)mm
System Weight1900 kg
Optional AccessoriesNone
Warranty

One year warranty , free replacement the parts due to original manufacturer's defect, but expect of man-made damages and force majeure

China SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon supplier

SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon

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