Product Details
Printed Circuit Board Multilayer PCB FR4 Material Custom-Made
Service
Specification:
Model: XCEM
Origin: China
Min line space: 10mil
Min line width: 10 mil
Board size: 16*6 cm
Layer: 8
Board thickness: 1.2mm
Copper foil: 35UM
Material: FR4
Our Quality:
We are committed to providing the HIGHEST QUALITY PCBs that not
only meet but exceed our customers’ expectations and requirements.
Our facilities hold a list of quality certifications (IS9001,
TS16949, UL) and the systems to support them. For quality control
purposes, we have invested extensively in inspection machinery,
including:
High-voltage E-test
Flying probe machine
Digital computer metallographic microscope
Copper thickness tester
Solderability detecting machine
Photoelectricity balance
X-ray gold thickness tester
Backlighting tester
Automatic optical inspector
Parameter:
Technology | Capabilities | Capabilities |
Max.Layer Count | 30 Layers | 30 Layers |
Max.Panel Size | 27.5"x24" | 27.5"x24" |
Max.Board Thickness | 3.5mm | 5.8mm |
Outer Layer | 3.5/3.5mils | 3/3mils |
Inner Layer | 3.5/3.5mils | 3/3mils |
Min.Board Thickness | 2L:6mils | 2L:6mils |
| 4L:15mils | 4L:15mils |
| 6L:23mils | 6L:23mils |
Min.SMT/BGA Pitch | 12mils for SMT | 12mils for SMT |
| 24mils for BGA | 20mils for BGA |
Min.Drill Size&Aspect Ratio | 0.2mm Drill for 0.8mm Thickness(4.0:1) | 0.2mm Drill for 0.8mm Thickness(4.0:1) |
| 0.25mm Drill for 1.6mm Thickness(6.4:1) | 0.25mm Drill for 1.6mm Thickness(6.4:1) |
| 0.30mm Drill for 2.4mm Thickness(8.0:1) | 0.30mm Drill for 2.4mm Thickness(8.0:1) |
Surface Finishes | HASL | HASL |
| Selective Immersion Tin | Selective Immersion Tin |
| Immersion Silver | Immersion Silver |
| Immersion Gold | Immersion Gold |
| Hard Gold | Hard Gold |
| OSP | OSP |
| Gold finger | Gold finger |
Controlled Impedance | +/- 10% | +/-7% |
Contouring | Routing, V-Groove, | Routing, V-Groove, |
| Beveling Punch | Beveling Punch |
Hole Diameter | +/- 2 mil | +/- 2 mil |
Min.S/M Thickness | 0.4 mil | 0.6 mil |
Company Profile
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing
various of printed circuit boards.
We have accumulated abundant experiences in the line of high
frequency microwave business for which widely apply to power
divider,combiner,power amplifier,line amplifier,base station,RF
antena,4G antena so on and so forth. Our company's sufficient
stocks of hi-frequency pcb materials such as
Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16)
mainly used in the area of high technologies like communication
device,Electronics,Aerospace,Military industry to meet our
worldwide customers with high quality. Furthermore,we also keen on
helping customers shorten the period of production development and
24 hours of sample service is available.
Since the day of company foundation we continuously engaged in
researching special and high precision printed circuit boards with
the strong production capability of 2 to 28 layers of highly
precise impedence,multi-layer blind buried,multi-layer
mix-compression,high TG, copper substrate,Ceramic substrate PCB. We
emphasize the significance of traning program for every single
staff in the company even grass-roots employees which becomes the
most competitive factors to excel from others,our company have many
experienced and professional teams from management to production
line,30% are highly educated among the total amount of
employees,advanced engineers and senior technicians are up to 80
people.
With advanced foreign technology supports and domestic 3G/4G device
manufacturer in microwave pcb field which lead our experienced
hi-frequency researching team to one step ahead of the line of
printed circuit board business,we are honored to obtain sound
reputations over our worldwide customers on the basis of fine
qulity,prompt delivery,satisfied after sales service for may years
and we assure our customers that we will return the favors with
more and more superior products in the near future.