Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape
Brand Name:Ziitek
Certification:RoHs
Model Number:TIA815
Minimum Order Quantity:10SQM
Delivery Time:2-3Work day
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
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Product Details
Heat Sink Thermal Conductive Adhesive Tape , 0.8 W / mK Glass Fiber Backing Heat Resistant Tape
The TIA™815 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
TIA800 Series Datasheet-(E)-REV01.pdf
Features
| Thermal Conductivity 0.9W/mK. |
| High bond strength to a variety of surfaces |
| Double sided pressure sensitive adhesive tape. |
| High performance, thermally conductive acrylic adhesive |
| allow for good conformability to irregular surfaces and good electrical isolation |
| Easy Application |
| Eliminates need for external hardware (screws, clips, etc.) |
| Available with easy release tabs |
Applications
| Mount heat sink onto BGA graphic processor or drive processor. |
| Mount heat spreader onto power converter PCB or onto motor control PCB |
| Can be used instead of heat cure adhesive,screw mounting or clip mounting |
| Heat sink onto BGA graphic processor |
| Heat sink to computer processor |
| Heat sink onto drive processor |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Monitoring the Power Box |
| AD-DC Power Adapters |
| Rainproof LED Power Supply |
| Waterproof LED Power Supply |
| Piranha wroof and common lED module |
| LED module for Channelletters |
| SMD LED module |
| LED Flesible strip, LED bar |
| LED PanelLight |
| Typical Properties of TIA™800 Series | ||||||
| Product Name | TIA™815 | Test Method | ||||
| Color | White | Visual | ||||
| Construction | Ceramic filled silicone elastomer | *** | ||||
| &Compostion | ||||||
| Composite Thickness | 0.015"/0.381mm | ASTM D751 | ||||
| Specific Gravity | 2.4 g/cc | ASTM D297 | ||||
| Specific Gravity | 1 l/g-K | ASTM C351 | ||||
| Hardness | 50 Shore A | ASTM 2240 | ||||
| Tensile Strength | >600 psi | ASTM D412 | ||||
| Continuous Use Temp | (-58 to 356℉) / (-50 to 180℃) | *** | ||||
| Electrical | ||||||
| Dielectric Breakdown Voltage | >5000 VAC | ASTM D149 | ||||
| Dielectric Constant | 5.5 MHz | ASTM D150 | ||||
| Volume Resistivity | 5.0X10" Ohm-meter | ASTM D257 | ||||
| Flame Rating | 94 V0 | equivalent UL | ||||
| Thermal | ||||||
| Thermal Conductivity | 0.9 W/m-K | ASTM D5470 | ||||
| Thermal lmpedance @50psi | 1.23℃-in²/W | ASTM D5471 | ||||
Standard Thicknesses:
0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.
Reinforcement:
TIA™800 Series sheets are fiberglass reinforced.
Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape
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