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OEM / ODM Copper Clad Laminate FR4 Multilayer Board, Multilayer PCB

OEM / ODM Copper Clad Laminate FR4 Multilayer Board, Multilayer PCB

Brand Name:ZhenXian
Certification:UL E354810,SGS
Model Number:YZX-256498
Minimum Order Quantity:NO MOQ
Delivery Time:5-12Days
Payment Terms:T/T,OA, L/C, Western Union
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Location: Shenzhen Guangdong
Address: 7/F, High-Tech Park, Shangkeng Community, Guanlan Subdist., Baoan District, Shenzhen, Guangdong, China (Mainland)
Supplier`s last login times: within 1 hours
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OEM / ODM Copper Clad Laminate FR4 Multilayer Board, Multilayer PCB

multilayer pcb
1:copper clad laminate pcb board
2.good quality,reasonable price
3.quicker delivery
4.One-stop service


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Specializing inDouble Side PCB, Multi-Layer PCB,F4BK PCB,Ceramic PCB,Rogers PCB,AluminumPCB,Bergqusit PCB . Meanwhile

Layer:1-30 Layers
Material: High Tg FR4, FR-4, Rogers PCB etc
Board Thickness: 0.1-8.0 mm

Treatment : LeadFree HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc.
Solder Mask : Green, Red, White, Yellow, Black, Blue.

* We can providequickturn prototype and small quantity PCBs with short lead time.
* The quality of Our products is excellent and stable.
* We choose the best material for all our products.
* We will send the boards to you by DHL, TNT, UPS, FEDEX and so on to savingthe transport time.
* For responsing promptly, we will reply you within two days.
We sincerely hope to establish longtime and friendly business relationship withyou. Good quality, reasonable price and the 5-Star service are guaranteed.
Pls. Send us PCB files or gerber data so that we can quote for you


multilayer pcb

Specification Inch (mm)

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium

Layer No.

1-30

Board thickness

0.0075"(0.2mm)-0.125"(3.2mm)


Board Thickness Tolerance

±10%

Cooper thickness

1/2OZ-4OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)

0.005"(0.125mm)


Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)


SMD Pitch (a)

0.012"(0.3mm)

BGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

Min Solder Mask Dam (a)

0.005"(0.125mm)


Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:1

Hole Registration

0.004"(0.1mm)

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-3u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Certificate

ROHS ISO9001:2000 TS16949 SGS UL

FR4 PCB from China, multilayer pcb


China OEM / ODM Copper Clad Laminate FR4 Multilayer Board, Multilayer PCB supplier

OEM / ODM Copper Clad Laminate FR4 Multilayer Board, Multilayer PCB

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